MAX837EUS MAXIM [Maxim Integrated Products], MAX837EUS Datasheet - Page 3

• Manufacturer Part Number: MAX837EUS
• Description: PLASTIC ENCAPSULATED DEVICES
• Manufacturer: MAXIM [Maxim Integrated Products]

II. Manufacturing Information
III. Packaging Information
IV. Die Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
per JEDEC standard JESD22-A112:
S3 (Standard 3 micron silicon gate CMOS)
54
California or Oregon, USA
Malaysia or Thailand
November, 1996
4 Lead SOT-143
Alloy 42 or Copper
Solder Plate
Silver-filled Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
Buildsheet # 05-1601-0019
Class UL94-V0
Level 1
44 x 31 mils
Si
Aluminum/Si (Si = 1%)
None
3 microns (as drawn)
3 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
4-Pin Micropower Voltage Monitor
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide)