MAX8815AETB+ MAXIM [Maxim Integrated Products], MAX8815AETB+ Datasheet - Page 2

• Manufacturer Part Number: MAX8815AETB+
• Description: 1A, 97% Efficiency, 30?A Quiescent Current Step-Up Converter with True Shutdown
• Manufacturer: MAXIM [Maxim Integrated Products]

1A, 97% Efficiency, 30µA Quiescent Current
Step-Up Converter with True Shutdown
ABSOLUTE MAXIMUM RATINGS
OUTS, BATT to GND ................................................-0.3V to +6V
POUT to OUTS ......................................................-0.3V to +0.3V
PGND (EP) to AGND .............................................-0.3V to +0.3V
FB to GND ................................................-0.3V to (V
ON, SKIPB to GND ............-0.3V to the higher of (V
LX Continuous Current (Note 1)..........................................2.75A
Continuous Power Dissipation (T
ELECTRICAL CHARACTERISTICS
(V
noted. Limits are 100% production tested at T
characterization.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Note 1: LX has internal clamp diodes to PGND (EP) and VPWR, where VPWR is the internal power node and is the higher of BATT
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
Idle Mode is a trademark of Maxim Integrated Products, Inc.
GENERAL
Operating Input Voltage Range
Minimum Startup Voltage
Shutdown Supply Current
Supply Current
OSCILLATOR
Switching Frequency
Maximum Duty Cycle
Output-Voltage Adjust Range
FB Regulation Voltage
FB Load Regulation
FB Line Regulation
FB Input Leakage Current
Idle Mode™ Trip Level
10-Pin TDFN Single-Layer Board (derate 18.5 mW/°C
above +70°C)...........................................................1481.5mW
OUTS
_______________________________________________________________________________________
= V
and OUTS. Applications that forward bias these diodes should take care not to exceed the power-dissipation limits of the
device.
board. For detailed information on package thermal considerations, visit www.maxim-ic.com/thermal-tutorial.
PARAMETER
POUT
= 5V, V
ON
= V
BATT
A
= +70°C)
ON = GND
No load, no switching, V
No load, switching (measured with external feedback);
V
No load, T
No load, T
V
V
V
(Note 4)
= 3.6V, V
POUT
BATT
FB
POUT
= 1.28V, V
= 1.8V to 5V, I
= 5V
= V
and (V
A
SKIPB
A
A
BATT
= +25°C. Limits over the operating temperature range are guaranteed by design and
= +25°C
= -40°C to +85°C (Note 3)
OUTS
BATT
OUTS
OUT
= GND, T
= 5.5V
+ 0.3V)
+ 0.3V)
+ 0.3V)
=
POUT
CONDITIONS
FB
A
= 0.5A
= 1.28V
= -40°C to +85°C, typical values are at T
T
T
T
T
A
A
A
A
= +25°C
= +85°C
=+25°C
= +85°C
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature Range ............................-40°C to +150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
10-Pin TDFN Multilayer Board (derate 24.4 mW/°C
above +70°C)...........................................................1951.2mW
10-Pin TDFN .................................................................8.5°C/W
10-Pin TDFN ..................................................................41°C/W
1.255
1.252
MIN
1.2
-50
1.8
3.3
A
1.265
1.265
= +25°C, unless otherwise
TYP
87.5
-7.5
-10
1.2
0.1
0.2
2.0
16
30
90
-5
-5
JC
) (Note 2)
JA
) (Note 2)
1.275
1.277
MAX
+50
5.5
1.5
2.2
5.0
30
1
UNITS
mV/D
mV/A
MHz
mA
µA
µA
nA
%
V
V
V
V