M93C46-R STMICROELECTRONICS [STMicroelectronics], M93C46-R Datasheet - Page 31

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M93C46-R

Manufacturer Part Number
M93C46-R
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet

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M93C86, M93C76, M93C66, M93C56, M93C46
Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
Table 26.
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
A
0.55
0.02
0.25
2.00
1.60
3.00
0.20
0.50
0.45
Typ
E
A1
millimeters
0.50
0.00
0.20
1.90
1.50
2.90
0.10
0.40
0.30
D
Min
Max
0.60
0.05
0.30
2.10
1.70
0.08
3.10
0.30
0.50
0.15
ddd
L3
0.022
0.001
0.010
0.079
0.063
0.118
0.008
0.020
0.018
Typ
D2
e
b
inches
Package mechanical
0.020
0.000
0.008
0.075
0.059
0.114
0.004
0.016
0.012
UFDFPN-01
Min
SS
L1
E2
L
. It must not be
0.024
0.002
0.012
0.083
0.067
0.003
0.122
0.012
0.020
0.006
Max
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