M24M01-HRCS3G/A STMICROELECTRONICS [STMicroelectronics], M24M01-HRCS3G/A Datasheet - Page 29

• Manufacturer Part Number: M24M01-HRCS3G/A
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24M01-R, M24M01-W, M24M01-HR
Figure 16. WLCSP8 – Wafer level chip scale package outline
1. Drawing is not to scale and corresponds to preliminary data.
2. The dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. The primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 17.
1. Preliminary data.
2. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
b
D
E
e
e1
e2
F
G
aaa
bbb
ccc
ddd
eee
N (number of bumps) 8
Symbol
WLCSP8 – Wafer level chip scale package mechanical data
eee Z
Bump
Wafer’s back side
D
0.580
0.230
0.350
0.322
3.570
2.050
0.600
2.400
1.200
0.585
0.424
0.110
0.110
0.110
0.060
0.060
Typ
Note 4
b(8X)
Detail A rotated by 90°
Orientation reference
(2)
Doc ID 12943 Rev 7
E
(4X)
aaa
millimeters
0.555
Min
A1
Seating plane
Side view
Z
0.605
3.685
2.165
(3)
A2
A
Max
Detail A
Orientation
reference
0.0228
0.0091
0.0138
0.0127
0.1406
0.0807
0.0236
0.0945
0.0472
0.0230
0.0167
0.0043
0.0043
0.0043
0.0024
0.0024
Typ
Bump side
Package mechanical data
e1
e2
F
0.0219
inches
Min
E1_ME
G
e
(2)
(1)
e2
0.0238
0.1451
0.0852
Max
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