W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 59

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

10.2.34 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q64DW provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in Figure 33a & 33b. For memory type
and capacity values refer to Manufacturer and Device Identification table.
CLK
(IO
(IO
CLK
(IO
(IO
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
15
*
*
7
= MSB
16
CLK
/CS
IO
IO
IO
IO
0
1
2
3
6
17
0
Memory Type ID15-8
Figure 33b. Read JEDEC ID Instruction (QPI Mode)
5
Figure 33a. Read JEDEC ID Instruction (SPI Mode)
Mode 3
Mode 0
18
1
4
19
Instruction (9Fh)
High Impedance
2
3
Instruction
20
3
0
9Fh
2
21
4
1
1
22
5
2
EFh
- 59 -
0
23
6
3
*
7
24
12
13
14
15
IOs switch from
Input to Output
ID15-8
7
4
6
25
10
11
8
9
8
5
5
26
Capacity ID7-0
4
5
6
7
9
ID7-0
6
Manufacturer ID (EFh)
Publication Release Date: January 13, 2011
4
27
0
1
2
3
10
3
28
11
Mode 3
Mode 0
2
29
12
1
30
13
0
14
Preliminary - Revision C
W25Q64DW
Mode 3
Mode 0
15