M27C256B-10B1X STMICROELECTRONICS [STMicroelectronics], M27C256B-10B1X Datasheet - Page 6

• Manufacturer Part Number: M27C256B-10B1X
• Description: 256 Kbit (32Kb x 8) UV EPROM and OTP EPROM
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M27C256B
Table 8B. Read Mode AC Characteristics
(T
Note: 1. V
Figure 5. Read Mode AC Waveforms
System Considerations
The power switching characteristics of Advance
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
this transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output. The associated transient voltage peaks
can be suppressed by complying with the two line
6/16
t
t
Symbol
EHQZ
GHQZ
A
t
t
t
t
AVQV
ELQV
GLQV
AXQX
= 0 to 70°C, –40 to 85°C, –40 to 105°C or –40 to 125°C; V
2. Sampled only, not 100% tested.
(2)
(2)
CC
Q0-Q7
A0-A14
E
G
t
must be applied simultaneously with or before V
ACC
t
t
t
t
t
Alt
OH
CE
OE
DF
DF
Address Valid to
Output Valid
Chip Enable Low to
Output Valid
Output Enable Low to
Output Valid
Chip Enable High to
Output Hi-Z
Output Enable High
to Output Hi-Z
Address Transition to
Output Transition
Parameter
CC
, has three seg-
tAVQV
tELQV
E = V
E = V
Test Condition
tGLQV
VALID
G = V
G = V
E = V
E = V
IL
IL
, G = V
, G = V
(1)
IL
IL
IL
IL
PP
and removed simultaneously or after V
IL
IL
Min
0
0
0
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor be used on every device between V
and V
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7µF bulk electrolytic capacitor should be
used between V
es. The bulk capacitor should be located near the
power supply connection point. The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
-90
Max
90
90
40
30
30
SS
CC
. This should be a high frequency capaci-
Min
tAXQX
= 5V ± 5% or 5V ± 10%; V
0
0
0
-10
M27C256B
Max
100
100
CC
50
30
30
tEHQZ
tGHQZ
VALID
and V
Min
0
0
0
PP
-12
.
SS
Max
120
120
60
40
40
for every eight devic-
-15/-20/-25
Min
AI00758B
0
0
0
Hi-Z
PP
Max
150
150
65
50
50
= V
CC
Unit
ns
ns
ns
ns
ns
ns
)
CC