LM2671LD-3.3 NSC [National Semiconductor], LM2671LD-3.3 Datasheet - Page 21

• Manufacturer Part Number: LM2671LD-3.3
• Manufacturer: NSC [National Semiconductor]

LLP PACKAGE DEVICES
The LM2671 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP.
21
The Die Attach Pad (DAP) can and should be connected to
PCB Ground plane/island. For CAD and assembly guidelines
refer
power.national.com.
to
Application
Note
AN-1187
www.national.com
at
http://