MTE1122 MICROCHIP [Microchip Technology], MTE1122 Datasheet - Page 4

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MTE1122

Manufacturer Part Number
MTE1122
Description
Energy Management Controller IC
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
MTE1122
ELECTRICAL CHARACTERISTICS
Absolute Maximum Rating †
Ambient temperature under bias .................................................................................................................-55 to +125°C
Storage Temperature.............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on RESET with respect to V
Total power Dissipation (Note 2) ...........................................................................................................................800mW
Max. Current out of V
Max. Current into V
Input Clamping Current, IIK (VI<0 or VI>V
Output Clamping Current, IOK (V0<0 or V0>V
Max. Output Current sunk by any I/O pin .................................................................................................................25mA
Max. Output Current sourced by any I/O pin............................................................................................................20mA
TABLE 2: DC CHARACTERISTICS POWER SUPPLY PINS
DS21112B-page 4
†NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device or compliance to AC and DC parametric specifications at
those or any other conditions above those indicated in the operation listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may affect device reliability.
Power Supply Pins
Supply Voltage
V
power on reset
V
Power-On Reset (Note 2)
Supply Current (Note 3)
Note 1: Data in the column labeled “Typical” is based on characterization results at 25 C. This data is for design guidance only and
Note 1: Voltage spikes below V
Note 2: Total power dissipation should not exceed 800 mW for the package. Power dissipation is calculated as fol-
DD
DD
2: This parameter is characterized but not tested.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
start voltage to guarantee
rise rate to guarantee
is not tested for, or guaranteed by Microchip Technology.
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
Characteristic
Thus, a series resistor of 50-100 should be used when applying a "low' level to the RESET pin rather than
pulling this pin directly to V
lows:
P
DD
DIS
with respect to V
= V
DD
DD
SS
pin ......................................................................................................................................100mA
x {I
pin ...................................................................................................................................150mA
DD
-
SS
I
OH
V
V
S
I
SS
DD
..................................................................................................................0 to +7.5V
SS
Sym
SS
} +
DD
POR
VDD
SS
at the RESET pin, inducing currents greater than 80mA, may cause latch-up.
(Note 1) ................................................................................................0 to +14V
(except V
.
DD
{(V
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating voltage V
0.05
Min
)
4.0
DD
DD
-V
)
DD
OH
Preliminary
(Note 1)
and RESET).................................................... -0.6V to V
) x I
Typ
Vss
1.8
OH
} + (V
Max Units
6.0
3.3
DD
OL
= 4.0V to 6.0V
V/ms
-40°C
0°C
mA
x I
V
V
OL
)
F
OSC
T
T
A
A
= 4 MHz, V
+ 85°C for industrial,
+70°C for commercial
1995 Microchip Technology Inc.
Conditions
DD
= 5.5V
DD
+0.6V
20mA
20mA

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