LX1671CLQ-TR MICROSEMI [Microsemi Corporation], LX1671CLQ-TR Datasheet - Page 2

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LX1671CLQ-TR

Manufacturer Part Number
LX1671CLQ-TR
Description
Multiple Output LoadSHARE PWM
Manufacturer
MICROSEMI [Microsemi Corporation]
Datasheet
Copyright © 2000
Rev. 1.2b, 2006-02-13
Supply Voltage (V
Supply Voltage (V
Driver Supply Voltage (V
Driver Supply Voltage (V
Linear Regulator Gate Drive, V
Current Sense Inputs (V
Error Amplifier Inputs (FB
Input Voltage (SS/Enable, LDDIS) ...................................................-0.3V to5.5V
Output Drive Peak Current Source (HO
Output Drive Peak Current Sink (HO
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Junction Temperature Calculation: T
The θ
system. All of the above assume no ambient airflow.
Note:
PW
LQ
THERMAL RESISTANCE
THERMAL RESISTANCE
JA
TM
numbers are guidelines for the thermal performance of the device/pc-board
Exceeding these ratings could cause damage to the device. All voltages are
with respect to Ground. Currents are positive into, negative out of specified
terminal.
The limitation on transient time is thermal and is due to zener diodes on the
supply pins, application of maximum voltages will increase current into that
pin and increase package power dissipation.
x = Denotes Phase 1, 2, or 3
Plastic TSSOP 38-Pin
Plastic MLP 38-Pin
A B S O L U T E M A X I M U M R A T I N G S
CC
CC
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
) DC ................................................................-0.3V to 5.5V
) Transient ......................................................-0.3V to 6.0V
SX
-
-
C
C
, C
JUNCTION TO
JUNCTION TO
x
x
X
, V
, V
T H E R M A L D A T A
, RF
SX
CCL
CCL
) ....................................................... -0.3V to 12V
LDGD
2,
J
) DC ............................................-0.3V to 12V
) Transient ...................................-0.3V to 14V
= T
LDFB)........................................-0.3V to 5.5V
...................................................-0.3V to 9V
x
A
, LO
+ (P
x
, LO
A
A
Integrated Products, Power Management
MBIENT
MBIENT
x
D
) .......................................1A (500ns)
x θ
x
)....................................1A (500ns)
JC
).
, θ
, θ
®
Microsemi
JA
JA
Multiple Output LoadSHARE™ PWM
85°C/W
35°C/W
P
RODUCTION
LDDIS
DGND
AGND
LDDIS
DGND
AGND
LDGD
RSVD
LDGD
RSVD
LDFB
LDFB
PG1
HO2
EO2
RoHS / Pb-free 100% Matte Tin Lead Finish
LO1
LO2
VC2
SS2
RF2
CS2
VS2
SS1
HO2
FB2
FB1
VC2
EO2
SS2
RF2
FB2
D
ATA
P A C K A G E P I N O U T
10
11
12
N.C. – No Internal Connection
1
2
3
4
5
6
7
8
9
S
13
38
19
1
RSVD – Do Not Use
HEET
14
37
PW P
N/U – Not Used
LQ P
(Top View)
(Top View)
Connect
to Power
36
15
Bottom
GND
ACKAGE
ACKAGE
35
16
17
34
18
33
38
20
LX1671
19
32
31
30
29
28
27
26
25
24
23
22
21
20
LO3
PG3
VCCL
VCC
N.C.
N.C.
VS3
CS3
N.C.
EO3
FB3
SS3
N.C.
N.C.
H01
VC1
VC3
HO3
LO3
PG3
VCCL
VCC
N/U
VS3
CS3
EO3
FB3
SS3
VS1
CS1
EO1
Page 2

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