VN330SP8932 STMICROELECTRONICS [STMicroelectronics], VN330SP8932 Datasheet - Page 8

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VN330SP8932

Manufacturer Part Number
VN330SP8932
Description
QUAD HIGH SIDE SMART POWER SOLID STATE RELAY
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
VN330SP(8932)
PowerSO-10™ Thermal Data
Figure 10. PowerSO-10™ PC Board
Figure 11. R
8/12
Layout condition of R
Cu thickness=35 m, Copper areas: from minimum pad lay-out to 8cm
55
50
45
40
35
30
RTHj_amb (°C/W)
thj-amb
0
Vs PCB copper area in open box free air condition
th
and Z
2
th
measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
PCB Cu heatsink area (cm^2)
4
6
2
Tj-Tamb=50°C
).
8
10

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