IX2127NTR CLARE [Clare, Inc.], IX2127NTR Datasheet

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... SMPS, and other converter drive topologies. The IX2127 is provided in 8-pin DIP and 8-pin SOIC packages, and is available in Tape & Reel versions. See ordering information below. Ordering Information Part 3 IX2127G IX2127N IX2127NTR Low Side High Side Low-High Transmitter Receiver Level Shift High-Low Receiver Transmitter Level Shift www ...

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Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Specifications 1.1 Package Pinout FAULT 3 COM 4 1.3 Absolute Maximum Ratings Unless otherwise specified, ratings are provided at T Parameter Logic Supply Voltage High Side Floating Supply Voltage High Side Floating Offset Voltage ...

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IX2127 1.4 Recommended Operating Conditions Parameter Logic Supply High Side Floating Supply High Side Offset Voltage Logic Input Voltage High Side Floating Output Current Sense Signal Voltage FAULT Output Voltage Ambient Temperature 1.5 General Conditions Typical values are characteristic of ...

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Logic I/O Specifications Parameter Logic “1” Input Voltage Logic “0” Input Voltage Logic “1” Input Bias Current Logic “0” Input Bias Current FAULT On-Resistance 1.6.4 Thermal Specifications Parameter Thermal Resistance, Junction to Ambient: 8-Lead DIP 8-Lead SOIC 1.7 Timing ...

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IX2127 1.7.2 I/O Timing Diagram IN CS FAULT HO 1.7.3 Switching Time Waveforms 50% IN 90% 10 1.7.4 Startup Blanking Time Waveforms 50 blk CS HO FAULT 6 1.7.5 CS Shutdown Waveforms ...

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Performance Data Quiescent V Supply Current I CC vs. Voltage 250 200 150 100 50 0 9.0 9.5 10.0 10.5 11.0 11.5 V Supply Voltage (V) CC Quiescent V Supply Current I CC QCC vs. Temperature 300 250 200 ...

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IX2127 Logic "1" Input Current vs. Voltage 9.0 9.5 10.0 10.5 11.0 11.5 Voltage (V) Logic "1" Input Current vs. Temperature 4.0 3.5 3.0 2.5 2.0 1.5 1.0 ...

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High-Level Output Voltage vs. Temperature 100 -10 -50 - 100 Temperature (ºC) Low-Level Output Voltage V OL vs. Temperature 100 90 ...

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IX2127 3 Manufacturing Information 3.1 Mechanical Dimensions 3.1.1 8-Pin DIP Through-Hole Package 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 4.064 TYP (0.160) 0.889 ...

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Tape & Reel Packaging for 8-Pin SOIC Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossed Carrier Embossment 3.2 Soldering For proper assembly, the component must be processed in accordance with the current revision ...