MC35XS3400 FREESCALE [Freescale Semiconductor, Inc], MC35XS3400 Datasheet

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... I/O RST SO SI I/O IN0 I/O IN1 I/O IN2 I/O IN3 A/D CSNS FSI GND Document Number: MC35XS3400 Rev. 5.0, 10/2008 35XS3400 HIGH SIDE SWITCH PNA SUFFIX (PB-FREE) 98ARL10596D 24-PIN PQFN ORDERING INFORMATION Temperature Device Package Range ( 40°C to 125°C 24 PQFN PWR HS0 LOAD HS1 ...

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INTERNAL BLOCK DIAGRAM VDD V Failure Detection CS SCLK I DWN SO SI RST WAKE FS IN0 IN1 IN2 IN3 DWN DWN DWN PWM Module Calibratable Oscillator V REG Programmable FSI Watchdog Over-temperature Prewarning ...

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Transparent Top View of Package SO GND HS3 Table 1. 35XS3400 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 17. Pin Pin Pin Name Number Function 1 CSNS ...

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PIN CONNECTIONS Table 1. 35XS3400 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 17. Pin Pin Pin Name Number Function 14, 17, 23 GND Ground Positive Power ...

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Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS V Supply Voltage Range PWR Load Dump at 25°C (400ms) ...

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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER INPUTS Battery Supply Voltage ...

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Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 (Continued) Output Drain-to-Source ON Resistance ( ...

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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 (continued) C Current ...

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Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic CONTROL INTERFACE (17) Input Logic High Voltage (17) Input Logic Low Voltage ...

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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO ...

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Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) (26) Fault Detection Blanking Time ...

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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Bulb Cooling Time Step CB[1:0]= ...

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Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic TEMPERATURE ON THE GND FLAG (32) Thermal Prewarning Detection Analog Temperature Feedback ...

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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS IN[0:3] high logic level low logic level CS high logic level low logic level V HS[0:3] V PWR V HS[0:3] 70% V PWR 30% V PWR I OCH 1 I OCH2 I OC1 Load I OC2 ...

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I OCH 1 I OCH2 I OC1 I OC2 I OC3 I OC4 I OCLO4 I OCLO3 I OCLO2 I OCLO1 RSTB RST 10% V 0.2 VDD TwRSTB t ENBL t W RST TENBL CS CSB 10% V 0.7VDD DD ...

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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS 90% V 3.5V SCLK SCLK SO 0.2 VDD SO 10% V Low-to-High Low to High SO SO 90% V 0.7 VDD High to Low High-to-Low Figure 8. SCLK Waveform and Valid SO Data Delay Time 35XS3400 ...

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The 35XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad 35 mΩ) can control four separate DS(ON) 28W bulbs. Programming, control and diagnostics are accomplished using a 16-bit SPI ...

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FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION GROUND (GND) These pins are the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR ...

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An analog feedback output provides a current proportional to the load current or the temperature of the board. The SPI is used to configure and to read the diagnostic status (faults) of high ...

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FUNCTIONAL DEVICE OPERATION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL DEVICE OPERATION SPI PROTOCOL DESCRIPTION The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK), ...

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The 35XS3400 has four operating modes: Sleep, Normal, Fail-safe and Fault. Table 5 and Figure 11 contained in succeeding paragraphs. The Figure 10 describes an internal signal called IN_ON[x] depending on IN[x] input. IN[x] IN_ON[x] Figure 10. IN_ON[x] internal signal ...

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FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES In the event of an external VPWR supply disconnect, an unexpected current consumption may sink on the VDD supply pin (In Sleep State). This current leakage is about 70mA instead of 5.0µA and it may ...

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FAIL-SAFE MODE The 35XS3400 is in Fail-safe mode when: • within the normal voltage range, PWR • wake- • fail = 1, • fault = 0. Watchdog If the FSI input is not grounded, the watchdog ...

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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES PROTECTION AND DIAGNOSTIC FEATURES PROTECTIONS Over-temperature Fault The 35XS3400 incorporates over-temperature detection and shutdown circuitry for each output structure. Two cases need to be considered when the output temperature is higher than T ...

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The SPI fault report (SC[0:3] bits) is removed after a read operation. Over-voltage Fault (Enabled by default) By default, the over-voltage protection is enabled. The 35XS3400 shuts down all outputs and FS will go to logic [0] during an over-voltage ...

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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES (OpenloadOFF=1 or ShortVpwr=1 (fault_control=1 and OV=0) or OV=1) OFF if hson=0 (fault_control=0 or OV=1) (fault_control=0) AUTO-RETRY The auto-retry circuitry is used to reactivate the output(s) automatically in case of over-current or over-temperature or ...

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Open-load Detection In On State The ON output open-load current thresholds can be chosen by SPI to detect a standard bulbs or LEDs (OLLED[0:3] bit set to logic [1]). In cases where the load current drops below the defined current ...

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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS The 35XS3400 successfully meets the Class 5 of the CISPR25 emission standard and 200V/m or BCI 200mA injection level for immunity tests. SERIAL INPUT COMMUNICATION SPI communication is accomplished using 16-bit messages. A ...

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DEVICE REGISTER ADDRESSING The following section describes the possible register addresses (D[14:10]) and their impact on device operation. ADDRESS XX000 — STATUS REGISTER (STATR_S) The STATR register is used to read the device status and the various configuration register contents ...

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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS A logic [1] on bit D0 (CSNS_ratio_s) selects the high ratio on the CSNS pin for the corresponding output. The default value [0] is the low ratio (Table 14). Table 14. Current Sense ...

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Table 19. PWM Module Selection PWM_en (D7) CLOCK_sel (D6 PWM module disabled 1 0 PWM module enabled with external clock from IN0 1 1 PWM module enabled with internal calibrated clock Bits D5:D4 allow the MCU to select ...

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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 22. Serial Output Bit Map Description Previous STATR STATR ...

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PREVIOUS ADDRESS SOA4 : SOA0 = A (PWMR_S) The returned data contains the programmed values in the PWMR register for the output selected with A PREVIOUS ADDRESS SOA4 : SOA0 = A (CONFR0_S) The returned data contains the programmed values ...

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TYPICAL APPLICATIONS The following figure shows a typical automotive lighting application (only one vehicle corner) using an external PWM clock from the main MCU. A redundancy circuitry has been V PWR Voltage regulator 100nF 10µF 100nF ...

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The 35XS3400 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 35XS3400 was qualified in accordance with JEDEC standards J-STD-020C Sn-Pb reflow profile. The maximum Analog Integrated Circuit Device Data ...

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PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below. 35XS3400 36 PACKAGE DIMENSIONS PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D Analog Integrated Circuit Device Data Freescale ...

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Analog Integrated Circuit Device Data Freescale Semiconductor PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D PACKAGING PACKAGE DIMENSIONS 35XS3400 37 ...

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PACKAGING PACKAGE DIMENSIONS 35XS3400 38 PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D Analog Integrated Circuit Device Data Freescale Semiconductor ...

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Analog Integrated Circuit Device Data Freescale Semiconductor PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D PACKAGING PACKAGE DIMENSIONS 35XS3400 39 ...

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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) Introduction This thermal addendum is provided as a supplement to the 35XS3400 technical data sheet. The addendum provides thermal performance information that may be critical in the design ...

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... Figure 15. 1s JEDEC Thermal Test Board Layout Transparent Top View MC35XS3400 Pin Connections 24 Pin PQFN (12 x 12) 0.9mm Pitch 12.0mm x 12.0mm Body Analog Integrated Circuit Device Data Freescale Semiconductor Figure 16. 2s2p JEDEC Thermal Test Board (Red - Top Layer, Yellow - Two Buried Layers) ...

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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 1.0) Device on Thermal Test Board Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07mm thickness Cu buried traces thickness 0.035mm Outline: 76.2mm x 114.3mm board area, including edge connector for ...

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Figure 19. Transient Thermal 1W Step Response; Device on 1s JEDEC Standard Thermal Test Board with Heat Spreading Areas 600 Sq. mm 100 10 1 0.1 0.000001 Figure 20. Transient Thermal 1W Step Response; Device ...

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REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 9/2008 • Initial release 4.0 • Changed Maximum rating for Output Source-to-Drain ON Resistance in Static Electrical Characteristics 10/2008 5.0 Table on page 7. • Added explanation for recovering to Sleep Mode on ...

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How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter ...