FM751V-FL FORMOSA [Formosa MS], FM751V-FL Datasheet - Page 6

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FM751V-FL

Manufacturer Part Number
FM751V-FL
Description
30mA Surface Mount Small Signal Schottky Diode- 40V
Manufacturer
FORMOSA [Formosa MS]
Datasheet
Suggested thermal profiles for soldering processes
SOD-323FL
PACKAGE
Reel packing
Small Signal Schottky Diode
FM751V-FL
TL
25
TP
1.Storage environment: Temperature=5
2.Reflow soldering of surface-mount devices
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
3.Reflow soldering
Tsmin
REEL SIZE
7"
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25 C to Peak Temperature
Tsmax
3,000
REEL
L
(pcs)
o
)
Profile Feature
Preheat
t25 C to Peak
L
o
o
COMPONENT
tS
P
)
SPACING
L
)
(m/m)
4.0
s
)
P
)
Time
Ramp-up
L
to T
30,000
o
C
(pcs)
BOX
P
~40
)
o
C
183*183*123
Page 6
Humidity=55%±25%
INNER
(m/m)
BOX
Tp
Ramp-down
(m/m)
REEL
178
TL
DIA,
Soldering Condition
255 C-0/+5 C
60~260sec
<3
60~120sec
<6 C/sec
10~30sec
<6minutes
382*262*387
<3 C/sec
o
150 C
200 C
CARTON
o
217 C
o
C
o
(m/m)
SIZE
/sec
o
o
o
Critical Zone
Document ID
DS-221657
TL to TP
o
Formosa MS
CARTON
Issued Date
2011/01/07
240,000
(pcs)
Revised Date
-
GROSS WEIGHT
APPROX.
Revision
9.5
(kg)
A
Page.
7

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