IRF9540NSTRL IRF [International Rectifier], IRF9540NSTRL Datasheet

no-image

IRF9540NSTRL

Manufacturer Part Number
IRF9540NSTRL
Description
Power MOSFET(Vdss=-100V, Rds(on)=0.117ohm, Id=-23A)
Manufacturer
IRF [International Rectifier]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF9540NSTRLPBF
Manufacturer:
IR
Quantity:
34 000
Part Number:
IRF9540NSTRLPBF
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
IRF9540NSTRLPBFL
Quantity:
800
Description
Absolute Maximum Ratings
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for
use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The D
for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a
typical surface mount application.
The through-hole version (IRF9540L) is available for low-
profile applications.
I
I
I
P
P
V
E
I
E
dv/dt
T
T
R
R
AR
D
D
DM
AS
AR
J
STG
D
D
GS
JA
@ T
@ T
JC
@T
@T
Advanced Process Technology
Surface Mount (IRF9540S)
Low-profile through-hole (IRF9540L)
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
2
C
C
Pak is a surface mount power package capable of
A
C
= 25°C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Parameter
Parameter
2
Pak is suitable
GS
GS
@ -10V
@ -10V
G
300 (1.6mm from case )
Typ.
–––
–––
D P ak
IRF9540NS/L
HEXFET
2
-55 to + 175
S
D
Max.
0.91
-5.0
140
± 20
430
-23
-16
-76
-11
3.8
14
®
R
T O -26 2
Power MOSFET
V
DS(on)
Max.
1.1
DSS
40
I
D
= -23A
PD - 91483C
= -100V
= 0.117
Units
Units
W/°C
V/ns
°C/W
mJ
mJ
°C
W
W
A
V
A
5/13/98

Related parts for IRF9540NSTRL

IRF9540NSTRL Summary of contents

Page 1

Advanced Process Technology Surface Mount (IRF9540S) Low-profile through-hole (IRF9540L) 175°C Operating Temperature Fast Switching P-Channel Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined ...

Page 2

IRF9540NS/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOTTOM - 4. -4 µ ...

Page 4

IRF9540NS ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.10 0.1 0.05 0.02 SINGLE PULSE 0.01 (THERMAL ...

Page 6

IRF9540NS Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V ...

Page 7

Peak Diode Recovery dv/dt Test Circuit + * D.U Reverse Polarity of D.U.T for P-Channel Driver Gate Drive Period P.W. D.U.T. I Waveform SD Reverse Recovery Body Diode Forward Current D.U.T. V ...

Page 8

IRF9540NS Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 ...

Page 9

Package Outline TO-262 Outline Part Marking Information TO-262 IRF9540NS/L ...

Page 10

IRF9540NS/L Tape & Reel Information 2 D Pak IRE CTIO (. (. IRE ...

Related keywords