A54SX16-1CG256 ACTEL [Actel Corporation], A54SX16-1CG256 Datasheet - Page 18

• Manufacturer Part Number: A54SX16-1CG256
• Description: SX Family FPGAs RadTolerant and HiRel
• Manufacturer: ACTEL [Actel Corporation]

Package Thermal Characteristics
The device junction-to-case thermal characteristic is θ
thermal characteristics for θ
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power dissipation allowed for an RT54SX16 in a CQFP 256-pin package
at military temperature and still air is shown in
Table 1-8 • Package Thermal Characteristics
1 -1 4
Package Type
RT54SX16
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Pack (CQFP)
RT54SX32
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Pack (CQFP)
A54SX16
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Pack (CQFP)
A54SX32
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Pack (CQFP)
SX Family FPGAs RadTolerant and HiRel
Absolute Maximum Power Allowed
ja
are shown with two different air flow rates.
=
Max. junction temp. (°C) – Max. ambient temp. (°C)
------------------------------------------------------------------------------------------------------------------------------------
EQ
1-1:
Pin Count
jc
v2.1
, and the junction-to-ambient air characteristic is θ
208
256
208
256
208
256
208
256
θ ja (°C/W)
7.5
4.6
6.9
3.5
7.9
5.6
7.6
4.8
θ
jc
=
Still Air
150°C – 125°C
-------------------------------------- -
θ
29
23
35
20
30
25
30
24
ja
23°C/W
=
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1.09 W
ja
EQ 1-1
. The