UPG2314T5N_0607 CEL [California Eastern Labs], UPG2314T5N_0607 Datasheet
UPG2314T5N_0607
Related parts for UPG2314T5N_0607
UPG2314T5N_0607 Summary of contents
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... The PG2314T5N is GaAs HBT MMIC for power amplifier which was developed for Bluetooth Class 1. This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting ...
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol Supply Voltage bias V enable Control Voltage V Circuit Current I Control ...
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ELECTRICAL CHARACTERISTICS (T = +25° bias enable output matching, unless otherwise specified) Parameter Symbol Circuit Current I Shut Down Current I shut down Output Power 1 P Output Power 2 P ...
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EVALUATION CIRCUIT OUTPUT bias enable 3 V cont The application circuits and their parameters are for reference only and are not intended for use in actual ...
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TYPICAL CHARACTERISTICS (T Condition : 450 MHz CIRCUIT CURRENT, EFFICIENCY, OUTPUT POWER vs. INPUT POWER –25 Condition : f ...
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Condition : 450 MHz OUTPUT POWER, 2f EFFICIENCY vs. SUPPLY VOLTAGE –10 –20 –30 –40 1.5 Condition : ...
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MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) Remark The mounting pad layouts in this document are for reference only. MOUNTING PAD 0.3 0.5 0.3 0.3 SOLDER PAD 0.475 0.25 0.475 0.25 Solder thickness : 0.08 ...
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PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Top View) 1.5±0.1 8 (Side View) +0.03 0.37 0.2±0.1 –0.05 Data Sheet PG10624EJ01V0DS µ PG2314T5N (Bottom View) 0.3±0.07 0.7±0.1 ...
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RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...
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Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) ...