INA-54063-BLK HP [Agilent(Hewlett-Packard)], INA-54063-BLK Datasheet - Page 6
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INA-54063-BLK
Manufacturer Part Number
INA-54063-BLK
Description
3.0 GHz Low Noise Silicon MMIC Amplifier
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
1.INA-54063-BLK.pdf
(10 pages)
Figure 11. Assembled 50
Capacitor C4 is optional and may
be used to add additional bypass-
ing for the V
passed V
necessary in cascades of ampli-
fier stages to prevent oscillation
that may occur as a result of RF
feedback through the power
supply lines.
For this demonstration circuit,
the value chosen for the RF
choke was 220 nH (Coilcraft
1008CS-221 or equivalent). All of
the blocking and bypass capaci-
tors are 1000 pF. These values
provide excellent amplifier
performance from under 50 MHz
through 2.5 GHz. Larger values
for the choke and capacitors can
be used to extend the lower end
of the bandwidth. Since the gain
of the INA-54063 extends down to
DC, the frequency response of the
amplifier is limited only by the
values of the capacitors and
choke.
A convenient method for making
RF connection to the demonstra-
tion board is to use a PCB mount-
ing type of SMA connector
cc
line is especially
cc
line. A well by-
INPUT
INA-5XX63 DEMO BOARD
C1
C3
Amplifier.
H
54
RFC
C2
(Johanson 142-0701-881, or
equivalent). These connectors
can be slipped over the edge of
the PCB and the center conduc-
tors soldered to the input and
output lines. The ground pins of
the connectors are soldered to
the ground plane on the backside
of the board. The extra ground
pins for the top of the board are
not needed and are clipped off.
The measured test results for the
50
amplifier using the INA-54063 are
shown in Figures 12 and 13.
Figure 12. Measured Gain of 50
Example Amplifier.
25
20
15
10
0.50
5
0
OUTPUT
input/output example
Vcc
0.75
05/95
1.00 1.25 1.50 1.75
C4
FREQUENCY (GHz)
6-168
2.00 2.25 2.50
Figure 13. Measured Input and
Output Return Loss for 50
Amplifier.
PCB Materials
Typical choices for PCB material
for low cost wireless applications
are FR-4 or G-10 with a thickness
of 0.025 or 0.031 inches. A
thickness of 0.062 inches is the
maximum that is recommended
for use with this particular
device. The use of a thicker board
material increases the inductance
of the plated through vias used
for RF grounding and may
deteriorate circuit performance.
Adequate grounding is needed not
only to obtain maximum amplifier
performance but also to reduce
any possibility of instability.
Phase Reference Planes
The positions of the reference
planes used to measure S-Param-
eters for this device are shown in
Figure 14. As seen in the illustra-
tion, the reference planes are
located at the point where the
package leads contact the test
circuit.
Figure 14. Phase Reference Planes.
-10
-12
-14
-16
-18
-20
-2
-4
-6
-8
0
0.50
0.75
Input
1.00 1.25 1.50 1.75
FREQUENCY (GHz)
TEST CIRCUIT
REFERENCE
Output
PLANES
2.00 2.25 2.50
Example