ISD2340 Winbond, ISD2340 Datasheet - Page 38
![no-image](/images/manufacturer_photos/0/7/712/winbond_sml.jpg)
ISD2340
Manufacturer Part Number
ISD2340
Description
SINGLE-CHIP/ MULTIPLE-MESSAGES/ VOICE RECORD/PLAYBACK DEVICE 32-/ 40-/ 48-/ AND 64-SECOND DURATION
Manufacturer
Winbond
Datasheet
1.ISD2340.pdf
(42 pages)
- Current page: 38 of 42
- Download datasheet (2Mb)
ISD2532/40/48/64
Notes:
12.4. D
o
o
o
[1]
[2]
Die Dimensions
Die Thickness
Pad Opening
The backside of die is internally connected to V
occur.
Die thickness is subject to change, please contact Winbond factory for status and availability.
X: 149.6 + 1 mils
Y: 206.3 + 1 mils
11.8 + .4 mils
111 microns (4.4 mils)
IE
B
ONDING
[2]
P
HYSICAL
L
AYOUT
[1]
SS
. It MUST NOT be connected to any other potential or damage may
- 38 -
NC
≈
A7
A8
A4
A6
A5
AUX IN
A3
A2
V
SSD
ISD2532/40/48/64
A1
V
A0
SSA
ISD2532/40/48/64
SP+
V
SP-
CCD
V
P/R
CCA
XCLK
MIC
MIC REF
EOM
AGC
≈
PD
OVF
CE
ANA IN
ANA OUT
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