LM6125 National Semiconductor, LM6125 Datasheet - Page 5

• Manufacturer Part Number: LM6125
• Description: High Speed Buffer
• Manufacturer: National Semiconductor

AC Electrical Characteristics
Note 5: For operation at elevated temperature, these devices must be derated based on a thermal resistance of
LM6125H and LM6225H is 17˚C/W. The thermal impedance
heat-sinking pins (pins 3, 4, 5, 10, 11, and 12) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal impedance
age is 60˚C/W.
Note 6: Limits are guaranteed by testing or correlation.
Note 7: The input is biased to +2.5V, and V
is reduced to 1.5 V
Note 8: The Error Flag is set (low) during current limit or thermal fault detection in addition to being set by the Shutdown pin. It is an open-collector output which re-
quires an external pullup resistor.
Note 9: Slew rate is measured with a
will be approximately
device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to
at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs.
Note 10: The test circuit consists of the human body model of 120 pF in series with 1500 .
Note 11: A military RETS specification is available on request. At the time of printing, the LM6125H/883 RETS spec complied with the Boldface limits in this column.
The LM6125H/883 may also be procured as Standard Military Drawing specification # 5962-9081501MXX.
Typical Performance Characteristics
Frequency Response
Overshoot vs Capacitive Load
Supply Current
PP
±
.
10V. Slew rate is calculated for transitions between
DS009222-15
DS009222-12
±
DS009222-9
11V input pulse and 50
IN
swings V
PP
Frequency Response
Large Signal Response
(R
−3 dB Bandwidth
about this value. The input swing is 2 V
L
JA
= 1 k )
(Continued)
of the device in the N package is 40˚C/W when soldered directly to a printed circuit board, and the
source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50
±
5V levels on both rising and falling edges. A high speed measurement is done to minimize
T
5
A
= 25˚C, V
DS009222-13
DS009222-16
DS009222-10
S
=
PP
±
at all temperatures except for the A
15V unless otherwise specified
Slew Rate vs Temperature
Large Signal Response
(R
Slew Rate
L
JA
= 50 )
and T
J
max, T
J
= T
V
±
3 test at −55˚C where it
A
10V for measurements
load, the output swing
+
JA
JA
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P
of the N pack-
DS009222-14
D
DS009222-17
DS009222-11
.
JC
for the