BUK1M200-50SDLD Philips Semiconductors, BUK1M200-50SDLD Datasheet - Page 5

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BUK1M200-50SDLD

Manufacturer Part Number
BUK1M200-50SDLD
Description
Quad channel TOPFET
Manufacturer
Philips Semiconductors
Datasheet
Philips Semiconductors
5. Thermal characteristics
Table 4:
9397 750 10956
Product data
Symbol
R
Fig 4. Normalized total power dissipation as a function of solder point temperature.
th(j-sp)
P
der
=
Parameter
thermal resistance from junction to
solder point.
Thermal characteristics
---------------------- -
P
tot 25 C
P
tot
100%
P der
(%)
120
80
40
0
0
Conditions
mounted on thermo clad board
one device active
all devices active
Rev. 01 — 02 April 2003
50
100
150
T sp ( C)
BUK1M200-50SDLD
03aa17
200
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Min
-
-
Quad channel TOPFET™
Typ
-
-
Max
45
13.3
Unit
K/W
K/W
5 of 14

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