TZA1032UK Philips Semiconductors, TZA1032UK Datasheet - Page 22

• Manufacturer Part Number: TZA1032UK
• Description: Laser driver and controller circuit
• Manufacturer: Philips Semiconductors

Philips Semiconductors
Bare die
a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips
Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.
Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems
after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify
their application in which the die is used.
15 PURCHASE OF PHILIPS I
2002 May 06
Laser driver and controller circuit
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for
Purchase of Philips I
components in the I
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C system provided the system conforms to the I
2
C components conveys a license under the Philips’ I
22
2
C specification defined by
Preliminary specification
2
C patent to use the
TZA1032