PA2423 SiGe Semiconductor Inc., PA2423 Datasheet - Page 7

• Manufacturer Part Number: PA2423
• Description: 2.4 GHz Bluetooth Class 1 Power Amplifier IC Production Information
• Manufacturer: SiGe Semiconductor Inc.

Package Dimensions
The PA2423MB is packaged in a 3.0 mm x 3.0 mm 8 lead MSOP package. The underside of the package is an exposed die-pad structure. This allows
for direct soldering to the PCB for enhanced thermal conductivity. The package dimensions are shown in the drawing below.
DOC# 05PDS001 Rev 9
07/26/2001
2.4 GHz Bluetooth Class 1 Power Amplifier IC
Page 7 of 10
Production Information
PA2423MB