MSM7579 OKI, MSM7579 Datasheet
MSM7579
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MSM7579 Summary of contents
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... MSM7578H/7578V/7579 Single Rail CODEC GENERAL DESCRIPTION The MSM7578 and MSM7579 are single-channel CODEC CMOS ICs for voice signals ranging from 300 to 3400 Hz. These devices contain filters for A/D and D/A conversion. Designed especially for a single-power supply and low-power applications, these devices are particularly optimized for telephone terminals in digital wireless systems and ISDN systems. ...
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Semiconductor BLOCK DIAGRAM – AIN– LPF AIN+ GSX SGC SG GEN SG – AOUT + SG 8th AD TCONT BPF CONV. AUTO PLL ZERO VR GEN RTIM 5th DA RCONT LPF CONV. PWD PWD Logic MSM7578H/7578V/7579 PCMOUT ...
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Semiconductor PIN CONFIGURATION (TOP VIEW) SGC 1 16 AIN AIN– AOUT 3 14 GSX (ALAW PDN 6 11 BCLK RSYNC 7 10 XSYNC PCMIN 8 9 PCMOUT 16-Pin ...
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Semiconductor PIN AND FUNCTIONAL DESCRIPTIONS AIN+, AIN–, GSX Transmit analog input and transmit level adjustment. AIN non-inverting input to the op-amp; AIN– inverting input to the op-amp; GSX is connected to the output of the ...
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Semiconductor V DD Power supply for +5 V. PCMIN PCM signal input. A serial PCM signal input to this pin is converted to an analog signal in synchronization with the RSYNC signal and BCLK signal. The data rate of ...
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... A pull-up resistor must be connected to this pin because its output is configured as an open drain. This device is compatible with the ITU-T recommendation on coding law and output coding format. The MSM7579 (A-law) outputs the character signal, inverting the even bits. Input/Output Level +Full scale +0 – ...
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Semiconductor SG Signal ground voltage output. The output voltage is 1/2 of the power supply voltage. The output drive current capability is 300 mA. This pin provides the SG level for CODEC peripherals. This output voltage level is undefined ...
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Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Analog Input Voltage Digital Input Voltage Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Analog Input Voltage Input High Voltage Input Low Voltage Clock Frequency Sync Pulse Frequency ...
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Semiconductor ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics Parameter Power Supply Current Input High Voltage Input Low Voltage High Level Input Leakage Current Low Level Input Leakage Current Digital Output Low Voltage Digital Output Leakage Current Input Capacitance Analog ...
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... AC Characteristics Parameter Transmit Frequency Response Receive Frequency Response Transmit Signal to Distortion Ratio Receive Signal to Distortion Ratio Transmit Gain Tracking Receive Gain Tracking *1 Psophometric filter is used *2 Upper is specified for the MSM7578H, lower for the MSM7579 Freq. Level Symbol Condition (Hz) (dBm0) Loss T1 60 ...
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... Temperature and Power) Absolute Delay Transmit Group Delay Receive Group Delay Crosstalk Attenuation *1 Psophometric filter is used *2 Upper is specified for the MSM7578H, lower for the MSM7579 *3 MSM7578H: All "1", MSM7579: "11010101" *4 Minimum value of the group delay distortion Freq. Level Symbol ...
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Semiconductor AC Characteristics (Continued) Parameter Discrimination Out-of-band Spurious Intermodulation Distortion Power Supply Noise Rejection Ratio Digital Output Delay Time *5 The measurement under idle channel noise Freq. Level Symbol Condition (Hz) (dBm0) 4.6 kHz DIS 0 ...
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Semiconductor TIMING DIAGRAM PCM Data Input/Output Timing Transmit Timing BCLK XSYNC XD1 SD PCMOUT MSD £ 1/2 • Fc, the Delay of the MSD bit is defined ...
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Semiconductor APPLICATION CIRCUIT Analog interface Analog input Analog output 0 V – The analog output signal has an amplitude of 1.2 V above and below the offset voltage level of ...
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Semiconductor RECOMMENDATIONS FOR ACTUAL DESIGN • To assure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for the power supply and keep them as close as possible to the device pins. • Connect the AG pin ...
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Semiconductor PACKAGE DIMENSIONS DIP16-P-300-2.54 MSM7578H/7578V/7579 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating more Solder plate thickness Package weight (g) 0.99 TYP. 16/18 ...
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... The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times) ...
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... The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times) ...