K9F1208D0B-D Samsung semiconductor, K9F1208D0B-D Datasheet - Page 43
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K9F1208D0B-D
Manufacturer Part Number
K9F1208D0B-D
Description
64M x 8 Bit NAND Flash Memory
Manufacturer
Samsung semiconductor
Datasheet
1.K9F1208D0B-D.pdf
(45 pages)
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K9F1208Q0B
K9F1208D0B
K9F1208U0B
READY/BUSY
The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random
read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command regis-
ter or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is
an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B) and
current drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig 23). Its value can be
determined by the following guidance.
V
CC
GND
Device
open drain output
R/B
Rp
Figure 23. Rp vs tr ,tf & Rp vs ibusy
ibusy
C
L
Ready Vcc
43
1.8V device - V
2.65V device - V
3.3V device - V
tf
VOL
OL
OL
OL
: 0.1V, V
: 0.4V, V
Busy
: 0.4V, V
FLASH MEMORY
OH
OH
OH
: Vcc
: 2.4V
: Vcc
Q
-0.1V
Q
-0.4V
tr
Advance
VOH
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