K4M56163PE-F1L Samsung, K4M56163PE-F1L Datasheet

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K4M56163PE-F1L

Manufacturer Part Number
K4M56163PE-F1L
Description
4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
Manufacturer
Samsung
Datasheet
K4M56163PE - R(B)G/F
4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
FEATURES
• 1.8V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
• Burst read single-bit write operation.
• Special Function Support.
• DQM for masking.
• Auto refresh.
• 64ms refresh period (8K cycle).
• Commercial Temperature Operation (-25°C ~ 70°C).
• Extended Temperature Operation (-25°C ~ 85°C).
• 54Balls FBGA with 0.8mm ball pitch
ORDERING INFORMATION
- R(B)G : Low Power, Extended Temperature(-25°C ~ 85°C)
- R(B)F : Low Power, Commercial Temperature(-25°C ~ 70°C)
Notes :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
( -RXXX : Leaded, -BXXX : Lead Free).
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
clock.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
-. DS (Driver Strength)
K4M56163PE-R(B)G/F90
K4M56163PE-R(B)G/F1L
Part No.
105MHz(CL=3), 66MHz(CL=2)
111MHz(CL=3), 83MHz(CL=2)
Max Freq.
GENERAL DESCRIPTION
rate Dynamic RAM organized as 4 x 4,196,304 words by 16 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design make a device controlled precisely
with the use of system clock and I/O transactions are possible
on every clock cycle. The range of operating frequencies, pro-
grammable burst lengths and programmable latencies allow the
same device to be useful for a variety of high bandwidth and
high performance memory system applications.
The K4M56163PE is 268,435,456 bits synchronous high data
*1
Interface
LVCMOS
Mobile-SDRAM
Leaded (Lead Free)
Package
54 FBGA
February 2004

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K4M56163PE-F1L Summary of contents

Page 1

... Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use. GENERAL DESCRIPTION The K4M56163PE is 268,435,456 bits synchronous high data rate Dynamic RAM organized 4,196,304 words by 16 bits, fabricated with SAMSUNG’s high performance CMOS technol- ogy ...

Page 2

... K4M56163PE - R(B)G/F FUNCTIONAL BLOCK DIAGRAM Bank Select CLK ADD LCKE LRAS LCBR LWE CLK CKE CS Data Input Register Column Decoder Latency & Burst Length Programming Register LCAS LWCBR Timing Register RAS CAS WE L(U)DQM Mobile-SDRAM LWE LDQM ...

Page 3

... K4M56163PE - R(B)G/F Package Dimension and Pin Configuration *1 < Bottom View *2: Top View Encapsulant Max. 0.20 *1: Bottom View *2 < Top View > #A1 Ball Origin Indicator > VSS B DQ14 C DQ12 D DQ10 E DQ8 F UDQM G A12 ...

Page 4

... K4M56163PE - R(B)G/F ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative Voltage on V supply relative Storage temperature Power dissipation Short circuit current NOTES: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. ...

Page 5

... K4M56163PE - R(B)G/F DC CHARACTERISTICS Recommended operating conditions (Voltage referenced to V Parameter Symbol Operating Current I CC1 (One Bank Active) CKE ≤ CC2 Precharge Standby Current in power-down mode PS CKE & CLK ≤ CC2 CKE ≥ CC2 Input signals are changed one time during 20ns ...

Page 6

... K4M56163PE - R(B)G/F AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition 1.8V 13.9KΩ VOH (DC) = VDDQ - 0.2V, IOH = -0.1mA Output VOL (DC) = 0.2V, IOL = 0.1mA 30pF 10.6KΩ Figure 1. DC Output Load Circuit ( ...

Page 7

... K4M56163PE - R(B)G/F OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter Row active to row active delay RAS to CAS delay Row precharge time Row active time Row cycle time Last data in to row precharge Last data in to Active delay Last data in to new col. address delay ...

Page 8

... K4M56163PE - R(B)G/F AC CHARACTERISTICS (AC operating conditions unless otherwise noted) Parameter CLK cycle time CAS latency=3 CLK cycle time CAS latency=2 CLK cycle time CAS latency=1 CLK to valid output delay CAS latency=3 CLK to valid output delay CAS latency=2 CLK to valid output delay CAS latency=1 ...

Page 9

... K4M56163PE - R(B)G/F SIMPLIFIED TRUTH TABLE COMMAND Register Mode Register Set Auto Refresh Entry Refresh Self Refresh Exit Bank Active & Row Addr. Read & Auto Precharge Disable Column Address Auto Precharge Enable Write & Auto Precharge Disable Column Address Auto Precharge Enable ...

Page 10

... K4M56163PE - R(B)G/F A. MODE REGISTER FIELD TABLE TO PROGRAM MODES Register Programmed with Normal MRS BA0 ~ BA1 Address A12 ~ A10/AP "0" Setting for Normal Function RFU MRS Normal MRS Mode Test Mode CAS Latency A8 A7 Type Mode Register Set Reserved ...

Page 11

... K4M56163PE - R(B)G/F Partial Array Self Refresh 1. In order to save power consumption, Mobile SDRAM has PASR option. 2. Mobile SDRAM supports 3 kinds of PASR in self refresh mode : Full Array, 1/2 of Full Array and 1/4 of Full Array. BA1=0 BA1=0 BA0=0 BA0=1 BA1=1 BA1=1 BA0=0 BA0=1 - Full Array Internal Temperature Compensated Self Refresh (TCSR) Notes : 1 ...

Page 12

... K4M56163PE - R(B)G/F C. BURST SEQUENCE 1. BURST LENGTH = 4 Initial Address BURST LENGTH = 8 Initial Address ...

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