TGA8334 TriQuint Semiconductor, TGA8334 Datasheet
TGA8334
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TGA8334 Summary of contents
Page 1
... Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression and thermosonic wire bonding processes. The TGA8334-SCC is supplied in chip form and is readily assembled using automated equipment. TriQuint Semiconductor Texas Phone: (972)994 8465 ...
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... TYPICAL OUTPUT POWER P 1dB TYPICAL SMALL-SIGNAL POWER GAIN TYPICAL RETURN LOSS TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8334-SCC Fax: (972)994 8504 Web: www.triquint.com 2 ...
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... STG o C base-plate temperature, derate linearly at the rate of 15.2 mW/ Fax: (972)994 8504 Web: www.triquint.com Product Data Sheet TGA8334-SCC DSS …………….……………… - dBm o ...
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... 50 CTRL D DSS A Fax: (972)994 8504 Web: www.triquint.com TGA8334-SCC S GAIN ANG(°) (dB) 0.36 -170 6.7 0.35 171 6.4 0.34 159 6.5 0.33 150 6.6 0.31 140 6.7 0.29 133 6.8 0.27 126 6.9 0.24 120 7.0 0.22 116 7 ...
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... DSS ETER = 0 3 ETER = Fax: (972)994 8504 Web: www.triquint.com Product Data Sheet TGA8334-SCC TES T C ONDITIONS TYP UNIT GHz GHz 26 dBm f = GHz GHz ±1 ...
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... RF connections: Bond using two 1.0-mil diameter 25-mil-length gold bond wires at both RF Input and RF Output. DC blocks required at RF Output port. Close placement of external components is essential to stability. Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8334-SCC Fax: (972)994 8504 Web: www.triquint.com 6 ...
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... MECHANICAL DRAWING GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8334-SCC Fax: (972)994 8504 Web: www.triquint.com 7 ...