BGY212 Philips Semiconductors, BGY212 Datasheet

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BGY212

Manufacturer Part Number
BGY212
Description
UHF amplifier module
Manufacturer
Philips Semiconductors
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
BGY212A
Manufacturer:
NXP
Quantity:
299
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D373
BGY212A
UHF amplifier module
Preliminary specification
1999 Aug 23

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BGY212 Summary of contents

Page 1

... DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage BGY212A UHF amplifier module Preliminary specification M3D373 1999 Aug 23 ...

Page 2

... Access (TDMA) operation (GSM systems) in the 1710 to 1785 MHz frequency range. DESCRIPTION The BGY212A is a three-stage UHF amplifier module in a SOT482C leadless package with a plastic cover. The module consists of one NPN silicon planar transistor die and one bipolar monolithic integrated circuit mounted together with matching and bias circuit components on a metallized ceramic substrate ...

Page 3

... L − 1.5 no degradation BGY212A = 575 µs unles p MAX. UNIT µ − dBm − dBm − dBm − dB − % −35 dBc −40 dBc − ...

Page 4

... Load power as a function of supply voltage; typical values ( 1700 1750 = 50 Ω 3 dBm ° C; δ 575 µ Fig.5 Load power as a function of frequency; typical values. BGY212A 1785MHz (V) S 1800 f (MHz) = 2.2 V; ...

Page 5

... Fig.7 Harmonics as a function of frequency; typical values. 16 output AM (%) 12 1710MHz 1785MHz - Ω 3 dBm Fig.9 Output amplitude modulation as a function of load power; typical values. BGY212A 1800 f (MHz (dBm ° 575 µ ...

Page 6

... The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (ε ⁄ 1 thickness inch. 32 1999 Aug 23 Fig.11 Test circuit VALUE DIMENSIONS 680 pF 100 nF 47 µ Ω width 2.3 mm 100 Ω; 0 Preliminary specification BGY212A CATALOGUE NO. 2222 851 11681 2222 910 16549 2222 030 37479 − 2322 156 11001 = 2.2); r ...

Page 7

... Bio-Act (Terpene Hydrocarbon) • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1999 Aug 23 300 handbook, halfpage T (°C) 200 100 Fig.12 Recommended reflow temperature profile. 7 Preliminary specification BGY212A MGM159 (min) ...

Page 8

... Solder paste Green tape area, max. height 0.03 mm Dimensions in mm. 1999 Aug 23 4.400 4.000 2.800 3.200 1.800 1.000 0.900 1.200 1.000 0.600 1.300 2.300 3.150 3.900 Fig.13 Footprint SOT482C. 8 Preliminary specification 4.000 0 scale 0.500 1.400 1.300 1.900 0.450 0.900 3.700 BGY212A 2.5 mm MGS345 ...

Page 9

... Aug pin 1 index 0 5 scale 0.6 0.70 13.7 13.35 2.0 0.4 0.57 13.3 13.05 REFERENCES JEDEC EIAJ 9 Preliminary specification 8.2 7.85 2.6 4.6 1.15 7.8 7.55 2.4 4.4 0.85 EUROPEAN PROJECTION BGY212A SOT482C 2.65 3.85 2.35 3.55 ISSUE DATE 99-05-18 99-08-16 ...

Page 10

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Aug 23 10 Preliminary specification BGY212A ...

Page 11

... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...

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