PC1602LRS-LWA-H-YM POWERTIP [Powertip Technology], PC1602LRS-LWA-H-YM Datasheet - Page 18

• Manufacturer Part Number: PC1602LRS-LWA-H-YM
• Description: PC1602LRS-LWA-H-YM
• Manufacturer: POWERTIP [Powertip Technology]

PC1602LRS-LWA-H-YM Ver.0 (DK)
NO
10
6
7
8
Appearance of frame
characteristic of
Assembly parts
A=( L + W ) 2
A=( L + W ) 2
A=( L + W ) 2
A=( L + W ) 2
Appearance of
Electrical
backlight
molding
Item
The shape of modeling is deformed by touching.
Insufficient epoxy: Circuit or pad of IC is visible
Excessive epoxy: Diameter of modeling is
or height is
The diameter of pinhole in modeling, A is
The folding angle of frame must be
The area of stripped electroplate in top-view of
frame, A is
Rust or crack is (Top view only)
The scratched width of frame is
The color of backlight is nonconforming
Backlight can t work normally.
The LED lamp can t work normally
The unsoldering area of pin for backlight,
The height of solder pin for backlight is
The mark or polarity of component is unidentifiable.
The height between bottom of component and
surface of the PCB is floating
D 1/4W
End solder joint width, D is
component termination or width of pad
Side overhang, D is
termination.
Component is cracked, deformed, and burned, etc.
The polarity of component is placed in inverse
direction.
Maximum fillet height of solder extends onto the
component body or minimum fillet height
is
A is
(Top view only)
0.5mm.
W
1/2 solder joint area.
D
1.0mm.
2.5mm
Page18
Specification
25% width of component
Pad
50% width of
0.7mm
0.06mm.
D
45 +10
2.0mm
0.2mm.
20mm
Judge
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Major
Major
Major
Major
Level