MC14049BDG ON Semiconductor, MC14049BDG Datasheet - Page 6

• Manufacturer Part Number: MC14049BDG
• Description: IC INVERTER HEX 1-INPUT 16SOIC
• Manufacturer: ON Semiconductor
• Series: 4000Br

Specifications of MC14049BDG

• Logic Type: Inverter
• Number Of Inputs: 1
• Number Of Circuits: 6
• Current - Output High, Low: 3.75mA, 24mA
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Logic Family: 4000
• Logical Function: Buffer/Converter
• Number Of Elements: 6
• Number Of Channels: 6
• Number Of Outputs: 6
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Package Type: SOIC
• Polarity: Inverting
• Propagation Delay Time: 140ns
• High Level Output Current: -4.7mA
• Low Level Output Current: 30mA
• Operating Supply Voltage (max): 18V
• Operating Supply Voltage (min): 3V
• Quiescent Current: 4uA
• Technology: CMOS
• Pin Count: 16
• Mounting: Surface Mount
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Package: 16SOIC
• Logic Function: Buffer/Converter
• Number Of Outputs Per Chip: 6
• Input Signal Type: Single-Ended
• Maximum Propagation Delay Time @ Maximum Cl: 140@5V|80@10V|60@15V ns
• Typical Quiescent Current: 0.006 uA
• Number Of Channels Per Chip: Hex
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Input Bias Current (max): 4 uA
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 6 / 6
• Logic Device Type: Buffer, Inverting
• Supply Voltage Range: 3V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 16
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: 4000 CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC14049BDG; MC14049BDGOS

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
MC14049B, MC14050B
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
PLASTIC DIP PACKAGE
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
D SUFFIX
P SUFFIX
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
6
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
M
A
B
C
D
F
G
K
P
R
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
10
INCHES
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_