MC74HC240ANG ON Semiconductor, MC74HC240ANG Datasheet
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MC74HC240ANG
Specifications of MC74HC240ANG
Related parts for MC74HC240ANG
MC74HC240ANG Summary of contents
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... Chip Complexity: 120 FETs or 30 Equivalent Gates • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 20 PDIP−20 ...
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... high impedance ORDERING INFORMATION Device MC74HC240AN MC74HC240ANG MC74HC240ADW MC74HC240ADWG MC74HC240ADWR2 MC74HC240ADWR2G MC74HC240ADTR2 MC74HC240ADTR2G MC74HC240AF MC74HC240AFG MC74HC240AFEL MC74HC240AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Current (per Package) Î Î Î Î Î Î Î Î Î Î Î Î Î Î NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î ...
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SEATING PLANE 20X 0. 18X MC74HC240A PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ...