SMBJ22CA/52 Vishay Semiconductors, SMBJ22CA/52 Datasheet

SMBJ22CA/52

Manufacturer Part Number

SMBJ22CA/52

Description

Manufacturer

Vishay Semiconductors

Datasheet

1.SMBJ22CA52.pdf (6 pages)

Specifications of SMBJ22CA/52

Date_code

05+

Packing_info

SMB

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DEVICES FOR BI-DIRECTION APPLICATIONS

For bi-directional devices use C or CA suffix

(e.g. SMBJ10CA).

Electrical characteristics apply in both directions.

Notes:

(1) Non-repetitive current pulse, per Fig. 3 and derated above T

(2) Mounted on 0.2 x 0.2" (5.0 x 5.0 mm) copper pads to each terminal

Document Number: 88392

Revision: 04-Sep-07

PRIMARY CHARACTERISTICS

MAXIMUM RATINGS (T

PARAMETER

Peak pulse power dissipation with a 10/1000 µs waveform

Peak pulse current with a 10/1000 µs waveform

Peak forward surge current 8.3 ms single half sine-wave uni-directional only

Operating junction and storage temperature range

FSM

Surface Mount T

(uni-directional only)

PPM

max.

DO-214AA (SMB J-Bend)

PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com

For technical questions within your region, please contact one of the following:

= 25 °C unless otherwise noted)

RANS

5.0 V to 188 V

150 °C

600 W

100 A

(1)

ORB

(1)(2)

= 25 °C per Fig. 2

(Fig. 1)

Transient Voltage Suppressors

FEATURES

TYPICAL APPLICATIONS

Use in sensitive electronics protection against voltage

transients induced by inductive load switching and

lighting on ICs, MOSFET, signal lines of sensor units

for consumer, computer, industrial, automotive and

telecommunication.

MECHANICAL DATA

Case: DO-214AA (SMBJ)

Molding compound meets UL 94 V-0 flammability

rating

Base P/N-E3 - RoHS compliant, commercial grade

Base P/NHE3 - RoHS compliant, high reliability/

automotive grade (AEC Q101 qualified)

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD22-B102

E3 suffix meets JESD 201 class 1A whisker test, HE3

suffix meets JESD 201 class 2 whisker test

Polarity: For uni-directional types the band denotes

cathode end, no marking on bi-directional types

• Low profile package

• Ideal for automated placement

• Glass passivated chip junction

• Available in uni-directional and bi-directional

• 600 W peak pulse power capability with a

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Meets MSL level 1, per J-STD-020, LF maximum

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC

(2)

10/1000 µs waveform, repetitive rate (duty

cycle): 0.01 %

peak of 260 °C

and WEEE 2002/96/EC

SMBJ5.0 thru SMBJ188CA

SYMBOL

Vishay General Semiconductor

, T

PPM

FSM

PPM

STG

See next table

- 55 to + 150

VALUE

600

100

www.vishay.com

UNIT

°C

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