MC74HCU04ADR2 ON Semiconductor, MC74HCU04ADR2 Datasheet

IC INVERTER HEX UNBUFFER 14SOIC

MC74HCU04ADR2

Manufacturer Part Number
MC74HCU04ADR2
Description
IC INVERTER HEX UNBUFFER 14SOIC
Manufacturer
ON Semiconductor
Series
74HCUr
Datasheet

Specifications of MC74HCU04ADR2

Logic Type
Inverter
Number Of Inputs
1
Number Of Circuits
6
Current - Output High, Low
5.2mA, 5.2mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC74HCU04ADR2OSCT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC74HCU04ADR2G
Manufacturer:
ON Semiconductor
Quantity:
8 500
Company:
Part Number:
MC74HCU04ADR2G
Quantity:
10 000
MC74HCU04A
Hex Unbuffered Inverter
High−Performance Silicon−Gate CMOS
MC14069UB. The device inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL
outputs.
are well suited for use as oscillators, pulse shapers, and in many other
applications requiring a high−input impedance amplifier. For digital
applications, the HC04A is recommended.
Features
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 4
The MC74HCU04A is identical in pinout to the LS04 and the
This device consists of six single−stage inverters. These inverters
Configurations
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V; 2.5 to 6.0 V in Oscillator
Low Input Current: 1 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With the JEDEC Standard No. 7.0 A Requirements
Chip Complexity: 12 FETs or 3 Equivalent Gates
Pb−Free Packages are Available
1
14
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
14
14
14
1
(Note: Microdot may be in either location)
1
1
ORDERING INFORMATION
1
A
L, WL
Y, YY
W, WW
G or G
http://onsemi.com
CASE 948G
CASE 751A
SOEIAJ−14
DT SUFFIX
TSSOP−14
CASE 646
CASE 965
N SUFFIX
D SUFFIX
F SUFFIX
SOIC−14
PDIP−14
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Publication Order Number:
14
1
14
1
14
1
MC74HCU04AN
14
DIAGRAMS
MC74HCU04A/D
AWLYYWWG
1
MARKING
74HCU04A
HCU04AG
AWLYWW
ALYWG
ALYWG
HCU
04A
G

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MC74HCU04ADR2 Summary of contents

Page 1

MC74HCU04A Hex Unbuffered Inverter High−Performance Silicon−Gate CMOS The MC74HCU04A is identical in pinout to the LS04 and the MC14069UB. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists ...

Page 2

... L ORDERING INFORMATION Device MC74HCU04AN MC74HCU04ANG MC74HCU04AD MC74HCU04ADG MC74HCU04ADR2 MC74HCU04ADR2G MC74HCU04ADTR2 MC74HCU04ADTR2G MC74HCU04AFEL MC74HCU04AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. LOGIC DIAGRAM ...

Page 3

... Plastic DIP: –10mW/_C from 65_ to 125_C SOIC Package: –7mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...

Page 4

... For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). 4. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). ...

Page 5

1/6 HCU04A out Figure 4. Crystal Oscillator R 2 1/6 HCU04A 1/6 HCU04A Figure 6. Schmitt Trigger V CC 1/6 HCU04A 1/6 HCU04A 1/6 HCU04A INPUT ...

Page 6

−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...

Page 7

... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...

Page 8

... S A −V− C 0.10 (0.004) −T− SEATING G D PLANE 14X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE 0.25 (0.010) ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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