MC14007UBFELG ON Semiconductor, MC14007UBFELG Datasheet

MC14007UBFELG

Manufacturer Part Number

MC14007UBFELG

Description

IC COMP DUAL PAIR W/INV 14SOEIAJ

Manufacturer

ON Semiconductor

Series

4000Br

Datasheet

1.MC14007UBCPG.pdf (9 pages)

Specifications of MC14007UBFELG

Logic Type

Configurable Multiple Function

Number Of Circuits

Number Of Inputs

Schmitt Trigger Input

Output Type

Single-Ended

Current - Output High, Low

10mA, 10mA

Voltage - Supply

3 V ~ 18 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

14-SOIC (5.3mm Width), 14-SOP, 14-SOIJ

Logic Family

4000

Number Of Channels Per Chip

Polarity

Inverting

Supply Voltage (max)

18 V

Supply Voltage (min)

3 V

Maximum Operating Temperature

+ 125 C

Mounting Style

SMD/SMT

High Level Output Current

- 4.2 mA

Low Level Output Current

4.2 mA

Minimum Operating Temperature

- 55 C

Number Of Lines (input / Output)

3 / 3

Propagation Delay Time

125 ns at 5 V, 75 ns at 10 V, 55 ns at 15 V

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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MC14007UB

Dual Complementary Pair

Plus Inverter

and three P−Channel enhancement mode devices packaged to provide

access to each device. These versatile parts are useful in inverter

circuits, pulse−shapers, linear amplifiers, high input impedance

amplifiers, threshold detectors, transmission gating, and functional

gating.

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Temperature Derating:

MAXIMUM RATINGS

October, 2006 − Rev. 8

Symbol

The MC14007UB multipurpose device consists of three N−Channel

Schottky TTL Load Over the Rated Temperature Range

precautions must be taken.

Diode Protection on All Inputs

Supply Voltage Range = 3.0 Vdc to 18 Vdc

Capable of Driving Two Low−power TTL Loads or One Low−power

Pin−for−Pin Replacement for CD4007A or CD4007UB

This device has 2 outputs without ESD Protection. Antistatic

Pb−Free Packages are Available

Plastic “P and D/DW” Packages: – 7.0 mW/°C from 65°C 5o 125°C.

, V

, I

stg

out

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input or Output Current

(DC or Transient) per Pin

Power Dissipation, per Package

(Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature

(8 second Soldering)

Parameter

(Voltages Referenced to V

−0.5 to V

−0.5 to +18.0

−55 to +125

−65 to +150

)

Value

± 10

500

260

+0.5

Unit

°C

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

GATE

ORDERING INFORMATION

WL, L

YY, Y

WW, W

D−P

S−N

D−N

S−P

http://onsemi.com

PIN ASSIGNMENT

CASE 751A

SOEIAJ−14

S = SOURCE

CASE 646

CASE 965

D SUFFIX

P SUFFIX

F SUFFIX

SOIC−14

PDIP−14

D = DRAIN

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Indicator

Publication Order Number:

D−P

OUT

S−P

GATE

S−N

D−N

MC14007UBCP

DIAGRAMS

AWLYYWWG

MC14007UB

MARKING

MC14007UB/D

AWLYWW

14007UG

ALYWG

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MC14007UBFELG Summary of contents

Page 1

MC14007UB Dual Complementary Pair Plus Inverter The MC14007UB multipurpose device consists of three N−Channel and three P−Channel enhancement mode devices packaged to provide access to each device. These versatile parts are useful in inverter circuits, pulse−shapers, linear amplifiers, high input ...

Page 2

INPUT INPUT OUTPUT CONDITION INPUT OPEN OPEN Substrates of P−Channel devices internally connected substrates of N−Channel DD devices internally connected to V ...

Page 3

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 4

SWITCHING CHARACTERISTICS Î Î Î Î Î ...

Page 5

V DD 0.01 mF 500 mF I CERAMIC PULSE in GENERATOR Figure 5. Switching Time and Power Dissipation Test Circuit and Waveforms The MC14007UB dual pair plus inverter, which has access to all its ...

Page 6

... Device MC14007UBCP MC14007UBCPG MC14007UBD MC14007UBDG MC14007UBDR2 MC14007UBDR2G MC14007UBFEL MC14007UBFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb− ...

Page 7

−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...

Page 8

... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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