MC14572UBCPG ON Semiconductor, MC14572UBCPG Datasheet

IC GATE HEX NAND/NOR/INV 16-DIP

MC14572UBCPG

Manufacturer Part Number
MC14572UBCPG
Description
IC GATE HEX NAND/NOR/INV 16-DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheets

Specifications of MC14572UBCPG

Logic Type
NAND/NOR Gate
Number Of Circuits
6
Number Of Inputs
8
Schmitt Trigger Input
No
Output Type
Single-Ended
Current - Output High, Low
3.5mA, 8mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Circuit Type
Low-Power Schottky
Current, Supply
30 μA
Function Type
6-Channels
Logic Function
Gate
Package Type
PDIP-16
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14572UBCPG
MC14572UBCPGOS
MC14572UB
Hex Gate
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These complementary MOS logic gates find
primary use where low power dissipation and/or high noise immunity
is desired. The chip contains four inverters, one NOR gate and one
NAND gate.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V
to the range V
(e.g., either V
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Input or Output Current (DC or Transient)
per Pin
Power Dissipation, per Package (Note 1)
Ambient Temperature Range
Storage Temperature Range
Lead Temperature (8−Second Soldering)
The MC14572UB hex functional gate is constructed with MOS
This device contains protection circuitry to guard against damage due to high
Unused inputs must always be tied to an appropriate logic voltage level
Inverter
Application
Schottky TTL Load over the Rated Temperature Range
Diode Protection on All Inputs
Single Supply Operation
Supply Voltage Range = 3.0 Vdc to 18 Vdc
NOR Input Pin Adjacent to V
NAND Input Pin Adjacent to V
NOR Output Pin Adjacent to Inverter Input Pin For OR Application
NAND Output Pin Adjacent to Inverter Input Pin For AND
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Pb−Free Packages are Available*
Packages: – 7.0 mW/_C From 65_C To 125_C
SS
SS
or V
Parameter
v (V
DD
in
). Unused outputs must be left open.
or V
(Voltages Referenced to V
out
) v V
SS
DD
DD
.
Pin to Simplify Use As An Inverter
Pin to Simplify Use As An
Symbol
V
in
I
in
in
V
T
and V
P
, V
, I
T
T
stg
DD
A
D
L
out
out
SS
out
)
−0.5 to +18.0
should be constrained
−55 to +125
−65 to +150
−0.5 to V
Value
+ 0.5
±10
500
260
DD
1
Unit
mW
mA
°C
°C
°C
V
V
†For information on tape and reel specifications,
MC14572UBCP
MC14572UBCPG
MC14572UBD
MC14572UBDG
MC14572UBDR2
MC14572UBDR2G
MC14572UBF
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
Device
1
1
ORDERING INFORMATION
A
WL, L
YY, Y
WW, W = Work Week
G
http://onsemi.com
CASE 751B
SOEIAJ−16
CASE 648
CASE 966
P SUFFIX
D SUFFIX
F SUFFIX
PDIP−16
SOIC−16
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
SOEIAJ−16
(Pb−Free)
(Pb−Free)
(Pb−Free)
SOIC−16
SOIC−16
SOIC−16
SOIC−16
Package
PDIP−16
PDIP−16
Publication Order Number:
16
16
16
1
1
1
2500/Tape & Reel
2500/Tape & Reel
MC14572UBCP
25 Units / Rail
25 Units / Rail
48 Units / Rail
48 Units / Rail
50 Units / Rail
DIAGRAMS
AWLYYWWG
MC14572UB
MC14572UB/D
MARKING
14572UBG
Shipping
AWLYWW
ALYWG

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MC14572UBCPG Summary of contents

Page 1

... Wafer Lot YY Year WW Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping MC14572UBCP PDIP−16 25 Units / Rail MC14572UBCPG PDIP−16 25 Units / Rail (Pb−Free) MC14572UBD SOIC−16 48 Units / Rail MC14572UBDG SOIC−16 48 Units / Rail (Pb−Free) MC14572UBDR2 SOIC−16 2500/Tape & Reel MC14572UBDR2G SOIC− ...

Page 2

MC14572UB PIN ASSIGNMENT OUT OUT OUT B F OUT OUT ...

Page 3

ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...

Page 4

SWITCHING CHARACTERISTICS Î Î Î Î Î ...

Page 5

0.25 (0.010) M −A− −B− −T− SEATING PLANE 0.25 (0.010 MC14572UB PACKAGE DIMENSIONS ...

Page 6

... Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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