MC74AC373DWG ON Semiconductor, MC74AC373DWG Datasheet - Page 10

• Manufacturer Part Number: MC74AC373DWG
• Description: IC LATCH OCT TRANSP 3ST 20-SOIC
• Manufacturer: ON Semiconductor
• Series: 74ACr
• Type: D-Typer

Specifications of MC74AC373DWG

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 2 V ~ 6 V
• Independent Circuits: 1
• Delay Time - Propagation: 7ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Number Of Circuits: 8
• Logic Family: 74AC
• Polarity: Non-Inverting
• High Level Output Current: - 24 mA
• Low Level Output Current: 32 mA
• Propagation Delay Time: 13.5 ns at 3.3 V, 9.5 ns at 5 V
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Bits: 8
• Number Of Elements: 1
• Latch Mode: Transparent
• Technology: CMOS
• Package Type: SOIC W
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 2V
• Operating Supply Voltage (max): 6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
D
−A−
F
M
T
A
S
D
B
10
20 PL
11
10
11
S
0.25 (0.010)
A1
B
E
N
A
A
MC74AC373, MC74ACT373
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
PLASTIC DIP PACKAGE
K
M
http://onsemi.com
C
T
CASE 738−03
CASE 751D−05
A
N SUFFIX
DW SUFFIX
PDIP−20
ISSUE E
SOIC−20W
M
ISSUE G
10
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
B
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
E
H
h
L
q
e
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.27 BSC
0
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
_
G
M
A
B
C
D
E
F
J
K
L
N
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
7
0.050 BSC
0.100 BSC
0.300 BSC
0
_
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_