MC74HCT573AN ON Semiconductor, MC74HCT573AN Datasheet - Page 6
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MC74HCT573AN
Manufacturer Part Number
MC74HCT573AN
Description
IC LATCH OCTAL 3ST LSTTL 20DIP
Manufacturer
ON Semiconductor
Series
74HCTr
Datasheet
1.MC74HCT573ADTR2G.pdf
(7 pages)
Specifications of MC74HCT573AN
Logic Type
D-Type Transparent Latch
Circuit
8:8
Output Type
Tri-State
Voltage - Supply
4.5 V ~ 5.5 V
Independent Circuits
1
Delay Time - Propagation
30ns
Current - Output High, Low
6mA, 6mA
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC74HCT573ANOS
SEATING
PLANE
−T−
20
1
G
20
1
E
F
−A−
18X
20X
e
B
0.25
D
M
D
T
20 PL
10
11
0.25 (0.010)
A
N
S
B
B
10
11
S
A1
PACKAGE DIMENSIONS
B
E
K
A
PLASTIC DIP PACKAGE
M
A
C
T
http://onsemi.com
T
CASE 751D−05
SEATING
PLANE
A
CASE 738−03
DW SUFFIX
N SUFFIX
M
PDIP−20
ISSUE E
ISSUE F
SO−20
6
J
L
20 PL
0.25 (0.010)
C
q
M
M
T
B
M
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
NOTES:
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
DIM
A1
A
B
C
D
H
E
e
h
L
q
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
A
B
C
D
E
G
K
M
N
F
J
L
12.65
10.05
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
1.27 BSC
0
0.050 BSC
0.100 BSC
0.300 BSC
_
0
INCHES
_
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
7
15
_
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
MAX
27.17
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_