MC74HCT373AN ON Semiconductor, MC74HCT373AN Datasheet
MC74HCT373AN
Specifications of MC74HCT373AN
Related parts for MC74HCT373AN
MC74HCT373AN Summary of contents
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... CASE 948E A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week ORDERING INFORMATION Device MC74HCT373AN MC74HCT373ADW MC74HCT373ADWR2 SOIC−WIDE MC74HCT373ADT MC74HCT373ADTR2 1 MARKING DIAGRAMS 20 MC74HCT373AN AWLYYWW 1 20 HCT373A AWLYYWW 1 20 HCT 373A ALYW 1 Package Shipping PDIP−20 1440 / Box SOIC−WIDE 38 / Rail 1000 / Reel TSSOP− ...
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LOGIC DIAGRAM DATA D3 INPUTS LATCH ENABLE 1 OUTPUT ENABLE Î Î Î Î Î Î Î Î Î Î Î Design Criteria Î ...
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... SOIC Package: – 7 mW/°C from 65° to 125°C TSSOP Package: − 6.1 mW/°C from 65° to 125°C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... NOTE: 1. Total Supply Current = I CC NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î Î ...
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LATCH 11 ENABLE OUTPUT 1 ENABLE 2.7 V INPUT D 1 PLH 90% 1 10% t TLH Figure 1. OUTPUT ...
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TEST POINT OUTPUT DEVICE UNDER C * TEST L *Includes all probe and jig capacitance Figure 5. TEST CIRCUITS TEST POINT OUTPUT DEVICE UNDER TEST *Includes all probe and jig capacitance http://onsemi.com 6 CONNECT TO V WHEN ...
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SEATING PLANE 20X 0. 18X PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE ...
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... N F DETAIL DETAIL E N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...