ILX518 Sony Corporation, ILX518 Datasheet - Page 9

• Manufacturer Part Number: ILX518
• Description: 5363-pixel X 3 line CCD Linear Sensor (Color)
• Manufacturer: Sony Corporation

Notes of Handling
1) Static charge prevention
2) Notes on Handling CCD Packages
Plastic portion
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
c) Be aware that any of the following can cause the package to crack or dust to be generated.
d) The notch of the plastic portion is used for directional index, and that can not be used for reference of
Ceramic portion
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap
with the notch of the plastic portion.
Cover glass
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
of the glass portion.)
(1)
39N
Adhesive
29N
(2)
– 9 –
(3)
29N
(4)
0.9Nm
ILX518K