HMMC-3104-BLK HP [Agilent(Hewlett-Packard)], HMMC-3104-BLK Datasheet - Page 5

• Manufacturer Part Number: HMMC-3104-BLK
• Description: DC-16 GHz Packaged Divide-by-4 Prescaler
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Assembly Notes
Independent of the bias applied
to the package, the backside of
the package should always be
connected to both a good RF
ground plane and a good
thermal heat sinking region on
the PC–board to optimize
performance. For single–ended
output operation the unused RF
output lead should be
terminated into 50W to a contact
point at the V
RF ground through a dc blocking
capacitor.
Figure 2. Package & Dimensions
Exposed heat sink on package bottom
must be soldered to PCB RF ground.
Figure 3. Assembly Diagram (Single-supply, Positive-bias Configuration shown)
5
CC
potential or to
V EE
RFin
RFin
V CC
A minimum RF and thermal PC
board contact area equal to or
greater than 2.67 x 1.65 mm
(0.105" x 0.065") with eight
0.020" diameter plated–wall
thermal vias is recommended.
MMIC ESD precautions,
handling considerations, die
attach and bonding methods are
critical factors in successful
GaAs MMIC performance and
reliability.
V CC (+4 .5 to +6 .5 vo lts)
RFout
RFout
V CC
V CC
~ 1 µ f Mon o b l o ck
To operate component from a negative supply, ground each
V CC connection and supply V EE with a negative voltage (- 4.5
to - 6.5v) bypassed to ground with ~ 1 m f capacitor.
RF out should be terminated in 50Ω to ground. (dc blocking
capacitor required for positive bias configuration.)
C apacito r
Agilent application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines”
provides basic information on
these subjects.
Moisture Sensitivity
Classification: Class 1, per
JESD22-A112-A.
Additional References:
PN #18, “HBT Prescaler
Evaluation Board.”
Notes:
-
-
-
-
y S
B
C
D
E
e
H
L
a
A
A
1
All dimensions in millimeters.
Refer to JEDEC Outline MS-012 for
additional tolerances.
Exposed heat slug area on pkg bottom =
2.67 x 1.65
Exposed heat sink on package bottom must
be soldered to PCB RF ground plane.
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