CB037G0123JBA AVX Corporation, CB037G0123JBA Datasheet

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CB037G0123JBA

Manufacturer Part Number
CB037G0123JBA
Description
Manufacturer
AVX Corporation
Datasheet

Specifications of CB037G0123JBA

Date_code
07+
Packing_info
1812-123

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CB037G0123JBA
Manufacturer:
AVX
Quantity:
2 400
Film Chip Capacitors
PEN DIELECTRIC – CB Series
APPLICATIONS
General purpose function in low voltage applications where
miniaturization and SMD is required. Typical applications
would be:
• Automotive (Airbag, Fuel injection calculator...)
• Telecom (Public switching systems, modems, telephone
• Industrial (SMPS, Power convertor module...)
Climatic Category
Capacitance Range
Tolerance on C
Nominal Voltages
Test Voltage
Soldering methods
Tangent of Loss Angle at 1kHz (DF)
Insulation resistance minimum : IR
Temperature range
20
PERFORMANCE CHARACTERISTICS
set, cordless, mobile)
R
55/125/56
1nF to 4.7μF
±5%, ±10%
25Vdc to 630Vdc
1.4Vr 2s to 25°C
IR or vapor phase reflow (not suitable for wave soldering)
< 100 x 10
for C ≤ 0.33μF IR > 1000 MΩ at 20°C for 1 min. charge at 10Vdc
for VR < 100Vdc and 100Vdc for VR ≥ 100Vdc
for C > 0.33μF IR. C > 400sec. at 20°C for 1 min. charge at 10Vdc
for VR < 100Vdc and 100Vdc for VR ≥ 100Vdc
-55°C to 125°C with voltage derating of 1.25%/°C between 105°C and 125°C
-4
GENERAL DESCRIPTION
Film chip capacitor using a naked and stacked construction with
metallized PEN (polyethylene naphtalate).
ADVANTAGES
• Use of high temperature dielectric films make these
• The intrinsic elasticity of the dielectric film allows an
• The self-healing property of film technology results to a
• Excellent thermal shock resistance.
• Low dissipation factor ESR & ESL.
• No piezoelectric effect.
• Available in tape and reel suitable for automatic placement.
• Non-polar construction.
capacitors suitable for IR or vapor phase reflow processes.
This chip is built without specific encapsulation.
excellent compatibility of the capacitor with all types of
material for printed circuit boards.
safety open failure mode and better overall reliability.
Active Layers : PEN dielectric
Outer Layer
Brass
Silver Epoxy
Resin
Ni Barrier Under
Termination
Termination Plating :
100% matte Sn

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