HI-3182CDM HOLTIC [Holt Integrated Circuits], HI-3182CDM Datasheet
HI-3182CDM
Related parts for HI-3182CDM
HI-3182CDM Summary of contents
Page 1
... ARINC output are available. In addition, the HI-3184 and HI-3187 products also have a each output. The HI-318X series of line drivers are intended for use where logic signals must be converted to ARINC 429 levels such as when using an ASIC, the HI-8282 ARINC 429 Serial Transmit- ter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the HI-8783 ARINC Interface Device ...
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... V other than +5V is needed, a separate +5V power supply REF is required for pin With the DATA (A) input at a logic high and DATA (B) input at a logic low, A will switch to the +V OUT REF switch to the -V rail (ARINC HIGH state). With both data ...
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... SYMBOL FUNCTION V POWER Reference voltage used to determine the output voltage swing REF STROBE INPUT A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally). SYNC INPUT Synchronizes data inputs DATA (A) INPUT Data input terminal A C INPUT ...
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... Output Voltage Low (Output to Ground) Output Voltage Null Input Capacitance Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter. Note 2. Interchangeability of force and sense is acceptable +15V -15V +5.0V Operating Temperature Range (unless otherwise specified). ...
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... HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 ADDITIONAL PIN CONFIGURATIONS HI-3182PS, HI-3183PS, HI-3188PS REF GND (See Note * ) - PIN SYNC - 3 PLASTIC DATA( SMALL OUTLINE OUT (ESOIC)** - GND - 8 Notes: * Pin 2 may be left floating ** Thermally Enhanced SOIC package ...
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... DESCRIPTION HI-3182CDI 16 PIN CERAMIC SIDE BRAZED DIP HI-3182CDT 16 PIN CERAMIC SIDE BRAZED DIP HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP HI-3182CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C ...
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... HI-318X PACKAGE DIMENSIONS .00865 ± .00115 (.220 ± .029) .110 TYP. .1535 ± .0035 (2.794) TYP. (3.899 ± .089) Detail .033 ± .017 (.838 ± ...
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... CERAMIC SIDE-BRAZED DIP .200 MAX (5.080 MAX) .125 MIN (3.175 MIN .018 ± .002 (.457 HI-318X PACKAGE DIMENSIONS .0105 ± .0015 (.2667 ± .0381) .295 ± .004 .190 ± .010 (7.493 ± .102) (4.826 ± .254) Detail A 0° ...
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... SQ. .173 .008 (4.394 .203) (10.414 28-PIN CERAMIC LEADLESS CHIP CARRIER .020 INDEX (.508 INDEX) PIN 1 .040 x 45° 3PLS (1.016 x 45° 3PLS) HI-318X PACKAGE DIMENSIONS PIN NO. 1 IDENT .045 x 45° .453 .003 (11 ...
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... J-LEAD CERQUAD .588 (14.935 .550 (13.970 .040 TYP. (1.016) TYP. .019 .003 (.483 .076) .520 (13.208 HI-318X PACKAGE DIMENSIONS .450 (11.430 .488 .008 (12.395 .203) .008 .203) .009 .229) .190 MAX. (4.826) MAX. .083 .009 (2.108 .229) .050 TYP. ...