MAAPGM0044-DIE MACOM [Tyco Electronics], MAAPGM0044-DIE Datasheet - Page 4

• Manufacturer Part Number: MAAPGM0044-DIE
• Description: Amplifier, Power, 0.5W 11.5-16.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 0.5W
11.5-16.5 GHz
Mechanical Information
Chip Size: 2.980 x 1.8030 x 0.075 mm
Bond Pad Dimensions
1.803mm.
1.654mm.
0.854mm.
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
0
RF In and Out
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Pad
0
Figure 5. Die Layout
V
V
DD
GG
Size (μm)
100 x 200
200 x 150
150 x 150
(
117 x 71 x 3 mils)
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.
Size (mils)
4 x 8
8 x 6
6 x 6
MAAPGM0044-DIE
Preliminary Information
0.854mm.
903207 —