MAAPGM0052-DIE MACOM [Tyco Electronics], MAAPGM0052-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0052-DIE
• Description: Amplifier, Distributed Power 4.0-18.0 GHz
• Manufacturer: MACOM [Tyco Electronics]

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M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Distributed Power
4.0—18.0 GHz
Mechanical Information
Chip Size: 3.000 x 3.000 x 0.075 mm
Bond Pad Dimensions
DC Gate Supply Voltage VG_B
DC Drain Supply Voltage VDD
RF In and Out
2.838mm
.0467mm
Pad
0
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
GND:G
GND:G
IN
GND:G
VD
Figure 8. Die Layout
VG_B
(118 x 118 x 3 mils)
Size (μm)
100 x 150
150 x 150
150 x 150
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Visit www.macom.com for additional data sheets and product information.
GND:G
GND:G
G N D : G
OUT
GND:G
GND:G
3.000mmm
2.268mm
MAAPGM0052-DIE
Size (mils)
Preliminary Information
4 x 6
6 x 6
6 x 6
903210 —
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