MAAPGM0053-DIE MACOM [Tyco Electronics], MAAPGM0053-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0053-DIE
• Description: Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz
• Manufacturer: MACOM [Tyco Electronics]

5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Assembly and Bonding Diagram
V
DD
RF
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
IN
0.1 μF
GND:G
GND:G
IN
GND:G
GND:G
GND:G
GND:G
GG
GND:G
100 pF
GND:G
VD
before applying positive bias to V
GND:G
GND:G
GND:G
GND:G
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GND:G
GND:G
GND:G
GND:G
100 pF
GND:G
GND:G
VG
GND:G
GND:G
GND:D
GND:G
GND:D
GND:G
OUT
GND:G
GND:G
0.1 μF
DD
MAAPGM0053-DIE
RF
to prevent
OUT
Preliminary Information
V
903217 —
GG