MAAPGM0078-DIE MACOM [Tyco Electronics], MAAPGM0078-DIE Datasheet - Page 7
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MAAPGM0078-DIE
Manufacturer Part Number
MAAPGM0078-DIE
Description
Amplifier, Power, 12W 2.0-6.0 GHz
Manufacturer
MACOM [Tyco Electronics]
Datasheet
1.MAAPGM0078-DIE.pdf
(7 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MAAPGM0078-DIE
Manufacturer:
m/a-com
Quantity:
5 000
7
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 12W
2.0-6.0 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die Attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Thermal Management is critical on this
part. Refer to Application Note AN3019
for applicable guidelines.
NOTE 1: All Application Notes may be ac-
cessed by going to http://www.macom.com/
Application%20Notes/index.htm.
NOTE 2: In implementing the DC/ RF cross-
over shown, the following rules must applied.
1.
2.
3.
4.
Die Handling:
Refer to Application Note AN3016.
the DC crossovers should approach and
cross the RF trace at a 90 degree angle;
the printed DC traces that approach the
RF line should be stopped 2 substrate
heights from the RF line edge;
the rated current capability of the DC
crossovers should be greater than the
maximum current of the device; and
the wires or ribbons used to make the
DC crossovers should clear the RF trace
by ~ 1 substrate height.
Figure 18. Recommended operational configuration. Wire bond as shown.
GG
before applying positive bias to V
V
GG
VDD
VGG
Gnd
RF
Crossover
Gate
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
0.1 F
0.01-
GND
RF
30
IN
100-
200
100-
200
pF
pF
100-
200
100-
200
pF
pF
100-
100-
200
200
pF
pF
DD
MAAPGM0078-DIE
to prevent
Preliminary Datasheet
100-
200
100-
pF
200
pF
0.1 F
0.01-
V
DD
Rev B
RF
Crossover
OUT
Drain