K4S511632D-KC SAMSUNG [Samsung semiconductor], K4S511632D-KC Datasheet - Page 5
![no-image](/images/no-image-200.jpg)
K4S511632D-KC
Manufacturer Part Number
K4S511632D-KC
Description
DDP 512Mbit SDRAM 8M x 16bit x 4 Banks Synchronous DRAM LVTTL
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.K4S511632D-KC.pdf
(9 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
K4S511632D-KC75
Manufacturer:
PHI
Quantity:
141
ABSOLUTE MAXIMUM RATINGS
K4S511632D
Note :
DC OPERATING CONDITIONS
Notes :
Recommended operating conditions (Voltage referenced to V
CAPACITANCE
Clock
RAS, CAS , WE, DQM
Address, CS,CKE
D Q
Voltage on any pin relative to Vss
Voltage on V
Storage temperature
Power dissipation
Short circuit current
Supply voltage
Input logic high voltage
Input logic low voltage
Output logic high voltage
Output logic low voltage
Input leakage current
0
~ DQ
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
1. V
2. V
3. Any input 0V
Parameter
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
8
I H
IL
DD
(min) = -2.0V AC. The undershoot voltage duration is
(max) = 5.6V AC. The overshoot voltage duration is
Parameter
supply relative to Vss
Pin
(V
DD
V
IN
= 3.3V, T
V
DDQ
V
Symbol
DD
.
A
V
V
V
V
, V
I
= 23 C, f = 1MHz, V
OH
OL
LI
IH
IL
DDQ
Symbol
V
C
C
C
V
Min
-0.3
C
Symbol
3.0
2.0
2.4
-10
DD
ADD
OUT
CLK
I N
-
IN
T
, V
I
, V
P
STG
OS
D
REF
OUT
DDQ
SS
= 0V, T
=1.4V
3ns.
3ns.
Typ
A
3.3
3.0
Min
0
5.0
5.0
5.0
4.0
-
-
-
200 mV)
= 0 to 70 C)
V
DD
Max
3.6
0.8
0.4
-55 ~ +150
10
-1.0 ~ 4.6
-1.0 ~ 4.6
-
+0.3
Max
10.0
10.0
9.0
6.5
Value
50
2
Unit
uA
V
V
V
V
V
Rev. 0.0 July. 2002
Unit
CMOS SDRAM
pF
pF
pF
pF
I
I
OH
OL
Unit
mA
W
V
V
Note
C
= -2mA
= 2mA
1
2
3
Note