M368L3223ETM-CC5 SAMSUNG [Samsung semiconductor], M368L3223ETM-CC5 Datasheet - Page 14
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M368L3223ETM-CC5
Manufacturer Part Number
M368L3223ETM-CC5
Description
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.M368L3223ETM-CC5.pdf
(19 pages)
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
256MB, 512MB DDR466 Unbuffered DIMM
System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR466 devices to ensure proper system perfor-
mance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
Slew Rate Characteristic
Slew Rate Characteristic
Delta Slew Rate
Input Slew Rate
Input Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
+100
+100
+150
tDS
+50
+50
tDS
+75
tIS
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
+100
+150
tDH
+50
tDH
+75
tIH
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
DCSLEW
SYMBOL
MIN
-
DDR466
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
(V/ns)
(V/ns)
MIN
0.5
-
4.5
4.5
5.0
5.0
DDR466
Notes
Notes
Notes
MAX
4.0
h
h
h
i
i
i
Notes
j
j
j
e,k
a,c,d,f,g
b,c,d,f,g
a,c,d,f,g
b,c,d,f,g
Notes
Notes
Units
V/ns
Revision 1.0 December, 2003
Notes
a, k
DDR SDRAM