MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet - Page 7
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MT55L256L36P
Manufacturer Part Number
MT55L256L36P
Description
8Mb ZBT SRAM
Manufacturer
MICRON [Micron Technology]
Datasheet
1.MT55L256L36P.pdf
(30 pages)
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TQFP PIN DESCRIPTIONS (CONTINUED)
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
14, 15, 16, 41, 65,
(a)
28-30, 51-53, 56,
(b)
26, 40, 55, 60,
57, 75, 78, 79,
54, 61, 70, 77
67, 71, 76, 90
38, 39, 42, 43
68, 69, 72-74
18, 19, 22-24
4, 11, 20, 27,
5, 10, 17, 21,
1-3, 6, 7, 25,
58, 59, 62, 63,
8, 9, 12, 13,
66, 91
95, 96
x18
n/a
88
31
84
14, 15, 16, 41, 65,
(a)
(b)
(d)
26, 40, 55, 60,
54, 61, 70, 77
67, 71, 76, 90
38, 39, 42, 43
4, 11, 20, 27,
5, 10, 17, 21,
(c)
52, 53, 56-59,
68, 69, 72-75,
18, 19, 22-25,
x32/x36
62, 63
78, 79
12, 13
28, 29
66, 91
2, 3, 6-9,
n/a
51
80
30
88
31
84
1
SYMBOL TYPE
NF/DQPa
NF/DQPb
NF/DQPd
NF/DQPc
MODE
(LBO#)
R/W#
V
DNU
DQa
DQb
DQd
DQc
V
V
NC
NF
DD
DD
SS
Q
Output Byte “b” is associated with DQb pins; Byte “c” is
Supply
Supply
Supply
Input/
Input
Input
NF/
I/O
–
–
–
7
ADV/LD# is LOW and is the only means for determining
READs and WRITEs. READ cycles may not be converted into
WRITEs (and vice versa) other than by loading a new
address. A LOW on this pin permits BYTE WRITE operations
and must meet the setup and hold times around the rising
edge of CLK. Full bus-width WRITEs occur if all byte write
enables are LOW.
Mode: This input selects the burst sequence. A LOW on
interleaved burst. Do not alter input state while device is
operating. LBO# is the JEDEC-standard term for MODE.
SRAM Data I/Os: Byte “a” is associated with DQa pins;
associated with DQc pins; Byte “d” is associated with
DQd pins. Input data must meet setup and hold times
around the rising edge of CLK.
No Function/Data Bits: On the x32 version, these pins are
No Function (NF) and can be left floating or connected to
GND to minimize thermal impedance. On the x36 version,
these bits are DQPs.
Power Supply: See DC Electrical Characteristics and
Operating Conditions for range.
Isolated Output Buffer Supply: See DC Electrical
Characteristics and Operating Conditions for range.
Ground: GND.
No Connect: These pins can be left floating or connected
to GND to minimize thermal impedance.
Do Not Use: These signals may either be unconnected or
wired to GND to minimize thermal impedance.
No Function: This pin is internally connected to the die and
will have the capacitance of an input pin. It is allowable to
leave this pin unconnected or driven by signals. Pin 84 is
reserved as an address pin for the 18Mb ZBT SRAM.
Read/Write: This input determines the cycle type when
this pin selects linear burst. NC or HIGH on this pin selects
8Mb: 512K x 18, 256K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTION
PIPELINED ZBT SRAM
©2001, Micron Technology, Inc.