M366S3253BTS-C75 SAMSUNG [Samsung semiconductor], M366S3253BTS-C75 Datasheet

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M366S3253BTS-C75

Manufacturer Part Number
M366S3253BTS-C75
Description
32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
M366S3253BTS
PC133 Unbuffered DIMM
Revision History
Revision 0.0 (May, 2000)
• PC133 first published.
Revision 0.1 (July, 2000)
• Added PC100@CL3 data on DC Characteristics, Operating AC Parameter, AC Characteristics.
REV. 0.1 July. 2000

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M366S3253BTS-C75 Summary of contents

Page 1

... M366S3253BTS Revision History Revision 0.0 (May, 2000) • PC133 first published. Revision 0.1 (July, 2000) • Added PC100@CL3 data on DC Characteristics, Operating AC Parameter, AC Characteristics. PC133 Unbuffered DIMM REV. 0.1 July. 2000 ...

Page 2

... DD PC133 Unbuffered DIMM FEATURE • Performance range Part No. Max Freq. (Speed) M366S3253BTS-C75 PC133@CL3 & PC100@CL3 • Burst mode operation • Auto & self refresh capability (8192 Cycles/64ms) • LVTTL compatible inputs and outputs • Single 3.3V 0.3V power supply • MRS cycle with address key programs Latency (Access from column address) Burst length ( & ...

Page 3

... M366S3253BTS PIN CONFIGURATION DESCRIPTION Pin Name CLK System clock CS Chip select CKE Clock enable A0 ~ A12 Address BA0 ~ BA1 Bank select address RAS Row address strobe CAS Column address strobe WE Write enable DQM0 ~ 7 Data input/output mask DQ0 ~ 63 Data input/output WP Write protection V /V Power supply/ground ...

Page 4

... M366S3253BTS FUNCTIONAL BLOCK DIAGRAM CS0 DQM0 DQM CS DQ0 DQ0 DQ1 DQ1 DQ2 DQ2 U0 DQ3 DQ3 DQ4 DQ4 DQ5 DQ5 DQ6 DQ6 DQ7 DQ7 DQM1 DQM CS DQ8 DQ0 DQ9 DQ1 DQ10 DQ2 U1 DQ11 DQ3 DQ12 DQ4 DQ13 DQ5 DQ14 DQ6 DQ15 DQ7 ...

Page 5

... M366S3253BTS ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on V supply relative to Vss DD Storage temperature Power dissipation Short circuit current Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. ...

Page 6

... M366S3253BTS DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, T Parameter Symbol Operating current I CC1 (One bank active) I CC2 Precharge standby current in power-down mode I CC2 I CC2 Precharge standby current in non power-down mode I CC2 I CC3 Active standby current in power-down mode I CC3 I CC3 Active standby current ...

Page 7

... M366S3253BTS AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition Output 870 (Fig output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter ...

Page 8

... M366S3253BTS AC CHARACTERISTICS (AC operating conditions unless otherwise noted) REFER TO THE INDIVIDUAL COMPONENET, NOT THE WHOLE MODULE. Parameter CLK cycle time CAS latency=3 CLK to valid CAS latency=3 output delay Output data CAS latency=3 hold time CLK high pulse width CLK low pulse width ...

Page 9

... M366S3253BTS SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Entry Refresh Self refresh Bank active & row addr. Read & Auto precharge disable column address Auto precharge enable Write & Auto precharge disable column address Auto precharge enable Burst stop ...

Page 10

... M366S3253BTS PACKAGE DIMENSIONS 0.118 (3.000) 0.125 0.375 (3.175) (9.525) 0.096 (2.44) A .118DIA 0.004 (3.000DIA 0.100) 0.350 (8.890) .450 (11.430) 0.250 (6.350) 0.123 (3.125 0.079 0.004 (2.000 0.100) Detail A Tolerances : .005(.13) unless otherwise specified The used device is 32Mx8 SDRAM, TSOP SDRAM Part No. : K4S560832B-TC75 5 ...

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