KMM372F3200BS1 SAMSUNG [Samsung semiconductor], KMM372F3200BS1 Datasheet - Page 20
![no-image](/images/no-image-200.jpg)
KMM372F3200BS1
Manufacturer Part Number
KMM372F3200BS1
Description
32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.KMM372F3200BS1.pdf
(20 pages)
DRAM MODULE
PACKAGE DIMENSIONS
(3.000DIA .100)
Tolerances : .005(.13) unless otherwise specified
The used device is 16Mx4 DRAM with EDO mode, TSOP II.
DRAM Part No. : KMM372F3200BS1 - KM44V16104BS.
.118DIA .004
(8.890)
(3.000)
0.350
0.118
Detail A
(6.350)
0.250
KMM372F3280BS1- KM44V16004BS.
(2.000 .100)
0.079 .0040
.450
(11.430)
A
0.1230 .0050
(3.125 .125)
(6.350)
0.250
(36.830)
1.450
( Front view )
( Back view )
(133.350)
(127.350)
(115.57)
5.250
5.014
4.550
Detail B
(6.350)
0.250
B
(6.350)
0.250
(2.000 .100)
0.079 .0040
(54.61)
2.150
C
0.1230 .0050
(3.125 .125)
KMM372F320(8)0BS1
(1.372)
0.054
Units : Inches (millimeters)
Detail C
(1.270)
0.050
(4.000 0.100)
(1.000 .050)
0.157 0.004
0.039 .002
(0.25 Max)
(R 2.000)
R 0.079
0.01Max
0.050 0.0039
(1.270 0.10)
(3.81Max)
0.150Max